ET5235:ETON stencil printer machine
Features
Technical parameter
Screen Frames max size | 737mm |
Screen Frames min size | 470mm |
Screen Frames thickness | 25~40mm |
PCB size(L* W) | Max size:520mm*350mm Min size:50mm*50mm |
PCB Thickness | 0.6-6mm |
PCB warpage | <1%(Max PCB diagonal) |
Transport height | 900±20mm |
Transport direction | Left-Right; Right-Left; Left-Left; Right-Right |
Transport speed | Max 1200mm/s Programmable |
Squeegee pressure | 0~10kg/cm |
Squeegee angle | 55℃Standard |
Squeegee type | Steel scraper(Standard),PV scraper(Option) |
Stencil separation speed | 0.1~20mm/sec Programmable |
Cleaning system | Dry,Wet,Vacuum (Programmable) |
Company introduction
The company has independently developed a number of intellectual property technologies, including 9 invention patents, 112 utility patents, and 12 software copyrights. It has successively won the "Shenzhen High and New Technology Enterprise", "National High and New Technology Enterprise", and "Industry Special Contribution Award". With its original solution, rigorous quality management, and perfect after-sales service system, the company has rapidly developed into a highly influential manufacturer in the field of SMT placement machine.
Related machine
We can provide a whole SMT production line,led light production line:
1.Pick and place machine
2. Loader machine
3. Conveyor machine
4. Stencil printer machine
5. Reflow oven machine
6. Unloader machine
7. Solder paste mixer
8. Roll to roll led strip light assembly machine
FAQ
What are the terms of payment?
A: FOB Shenzhen is OK.
How to pay after buying the product?
A:For payment, we only support T/T at present. If you choose T/T, you will have to pay 30% deposit, and the remaining amount will be paid before shipment.
How long is the product warranty period?
A:Effective within one year after installation.
Main process flow of SMT
What are the elements of the SMT placement machine placing process?
Printing solder paste: Use wire mesh to leak solder paste onto PCB pads in preparation for component welding. The equipment required for this process is a solder paste printing machine, which is divided into fully automatic and semi-automatic.
Mounting: The equipment required for accurately installing surface mounted components to their corresponding fixed positions on the PCB is a placement machine.
Furnace welding:The purpose is to melt the solder paste so that the components on its surface can be combined with the PCB board. The required equipment is a reflow oven.
Contact David
Whatsapp/Wechat: +86 13827425982
E-mail: david@eton-mounter.com