Smt Automatic Stencil Printer/solder Paste Machine/led lighting production lights
ET-F1500 automatic stencil printer
The difference between automatic and semi-automatic stencil printer
In the process of printing solder paste, the automatic solder paste printing machine is placed on the workbench, mechanically or vacuum clamped, and aligned with positioning pins or vision. Or a screen or template for solder paste printing.
In a manual or semi-automatic press, the solder paste is manually placed on the stencil/screen, with the print squeegee at the other end of the stencil. In automatic printers, solder paste is automatically dispensed.
During the printing process, the printing blade is pressed down onto the stencil so that the bottom surface of the stencil contacts the top surface of the board. As the doctor passes the length of the entire pattern area that is corroded, the solder paste is printed onto the pads through the openings in the stencil/screen.
ET-F1500 suitable for most of pcb size
ET-F1500 suitable for max pcb size 1500*350 mm and min size 80*50 mm
Suitable for 0.4-6 mm thickness pcb and the waepage is no more than 1%.
PCB location
The support system is magnetic pin/up-down table adjusted/supportblock and clamping system is side clamping, vacuum nozzle
Transport
ET-F1500 Transport height is 860-940 mm and the direction support left-right, right-left, left-left, right-right
The Max transport speed is 1500 mm/s programmable
Screen frames
Screen Frames | Min Size | 1100X300mm |
Max Size | 1800X750mm | |
Thickness | 25~40mm |
Squeegee
Squeegee Speed | 6~200mm/sec |
Squeegee Pressure | 0~15Kg |
Squeegee Angle | 60°/55°/45° |
Squeegee Type | Stainless steel(Standard), plastic |
Firm packaging
We use a combination of wooden case packaging and vacuum film wrapping, and we pack it with a rope and a stand.
Delivery deadline
Around 4 weeks after payment.
Exported
We have exported more than 20 countries, such as USA, Korea, India, Germany, Eygpt, Turkey, Vienam, Tunisia, etc.