Touch Screen SMT Mounting Machine Smd Soldering Machine For Strip Light

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Main Features of smd soldering machine

1. Control Syetem: Ball screw,magnetic and servo motors

2. Vision system: 5 sets of imported camera.vision alignment,Mark correction.

3. 68 placement heads: can pick up and calibrate components at one time.

4. 68 feeders: Sufficient feeding platform improves loading efficiency.

5. Components:LED 3014/3020/3528/5050 and resistors,capacitors,bridge rectifiers.

6. Built-in computer mainboard: the monitor, key board and mouse will ship with machine.

7. Video tutorials: make you operate machine easily

8. Free to upgrade software: and provide technology support for life.

Technical parameter of smd soldering machine

Remarks:

1. Payment terms: Deposit 30% in advance,the balance 70% should be paid before shipment by T/T.

2. Delivery time: 30 days after deposit.

3. Warranty: 1 year.(including spare parts)

SMT LINE:

The surface mount assembly process mainly includes the following steps: solder paste printing, component mount, and reflow soldering. The steps are summarized as follows:
Stencil Printing: solder paste is a follow-up material for the surface adhesive components and PCB to connect with each other. First, the steel plate is etched or laser cut, and then the solder paste is printed on the welding pad of PCB by the squeegee of the Printing machine, so as to enter the next step.
Component Placement: Component Placement is the key technology and work focus of the entire SMT process. The process USES highly precise automatic mounting equipment to accurately place the surface mount components on the solder pad of the printed PCB through computer programming.As the design of surface adhesive components is becoming more and more precise, the distance between the joints is becoming smaller, so the technical level difficulty of placement operation is increasing day by day.
Reflow Soldering,(Reflow Oven) : Reflow Soldering is to have been placed on the surface of adhesive components of the PCB, after Reflow furnace first preheating with activated flux, to raise its temperature to 217 ℃ melt solder paste, feet and PCB Soldering pad connected components, then after cooling, cooling, make the solder curing, surface adhesive components and PCB bonding is completed.