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Automatic 12 Chip Head 1200KG PCB Surface Mounting Machine
Automatic 12 Chip Head 1200KG PCB Surface Mounting Machine
Automatic 12 Chip Head 1200KG PCB Surface Mounting Machine
Automatic 12 Chip Head 1200KG PCB Surface Mounting Machine
Automatic 12 Chip Head 1200KG PCB Surface Mounting Machine
Automatic 12 Chip Head 1200KG PCB Surface Mounting Machine
Specifications
Place of Origin :
China
Brand Name :
OEM
Supply Ability :
100pcs per month
Packaging Details :
Standard Export Packing
MOQ :
1 unit
Price :
Negotiable
Certification :
CE , ISO
Delivery Time :
15-20 days
Payment Terms :
L/C, T/T, Western Union, Paypal
Application :
SMT PCB Assembly Production Line
Name :
Place Machine\LED Mounter\led Assembly Machine
Product name :
Automatic SMD Capacitor Placement Machine
Usage :
SMD LED SMT
Applicable Components :
0201-120mm * 90mm, BGA, CSP,Connectors, other odd-shaped components
Condition :
100% Original
Dimension :
1250*1770*1420mm
Weight :
1200KG
Transfer height :
900 ± 20mm
Type :
Automatic
Description
Automatic 12 Chip Head PCB Surface Mounting Machine
Product Description

ultra-flexible 12-chip head 3D MID three-dimensional placement machine is a product from the market for dispensing / spot solder paste / three-dimensional patch and comes with optical inspection to complete the assembly of the machine, from The smallest metric 0201 components to 120mm large components include dispensing/point solder paste/stereo mounting/pressing inserts/special inspection lenses, high precision and high speed assembly, and quick dispensing of the dispensing head. The patch head and the inspection head are switched, and the concave surface, the inclined surface, and the curved surface can be stereoscopically mounted, realizing high speed and ultra-wide use.

Main Feature:

1, to achieve 3D MID (MoldedInterconnect Device) process, the new frame and tilt structure can be three-dimensional assembly of concave and convex surface, inclined surface and curved surface, helping customers to achieve a leap from flat panel assembly to three-dimensional assembly, reducing assembly costs.

2, to achieve a combination of spot solder paste / point red glue / patch / plug-in function, and easy to switch, non-contact point plastic head can be spot solder paste on the cavity substrate to achieve stereoscopic three-dimensional assembly of uneven surface.

3, optical inspection of the spot solder paste and glue and the mounted components, the newly developed color mark point recognition camera can also perform stable optical inspection of the solder paste/glue shape and patch effect through the new illumination system (realizing AOI) +SPI function)

4, 2 types of head structure are available for selection, 6 patch head 6 rotation axis type and 12 patch head 2 rotation axis type.

5, large substrate assembly capability, the substrate can be up to 1825mmx 635mm (optional) without segmentation once board capacity 1240mm x 510mm

6, ultra-wide component range, from ultra-small 0201 (0.25x0.125mm) chip to 120mm large components can be processed, placement height of 35mm, easy to install ultra-high components.

7, super large feeding capacity, S20 8mm loading port reaches 4 * 45 = 180 types, S10 8mm loading port reaches 2 * 45 = 90 types, waffle plate loading 36 types and can achieve non-stop refueling.

8, motor gun and refueling car and achieve interchange with M10/M20.

Specifications

Model name

S10

S20

Board
Size

With buffer unused

Min. L50 x W30mm to
Max. L980 x W510mm

Min. L50 x W30mm to
Max. L1,480 x W510mm

With input or output buffers used

Min. L50 x W30mm to
Max. L420 x W510mm

—

With input and output buffers used

Min. L50 x W30mm to
Max. L330 x W510mm

Min. L50 x W30mm to
Max. L540 x W510mm

With input and output buffers used

0.4 - 5.0mm

Placement accuracy A (μ+3σ)

CHIP ± 0.040mm

Placement accuracy B (μ+3σ)

IC ± 0.025mm

Placement angle

± 180°

Component height
(Board thickness + component height)

6-axis 6-theta head: Max. 35mm
12-axis 2-theta head: Max. 20mm

Applicable Components

0201-120mm x 90mm, BGA, CSP,Connectors,
other odd-shaped components

Component package

8-56mm tape (F1/F2 Feeders),
8-88mm tape (F3 Electric Feeders),
Stick, Tray

Component types
(8mm tape conversion)

Max. 90 types
(8mm tape), 45 lanes x 2

Max. 180 types
(8mm tape), 45 lanes x 4

Transfer height

900 ± 20mm

Machine Dimensions

L1,250 x D1,770 x
H1,420mm

L1,750 x D1,770 x
H1,420mm

Weight

Approx. 1,200kg

Approx. 1,500kg
Automatic 12 Chip Head 1200KG PCB Surface Mounting Machine
Product tags

pcb mounting machine

,

pcb component mounting machine

,

surface mount pcb assembly
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Automatic 12 Chip Head 1200KG PCB Surface Mounting Machine

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Product Detail
Place of Origin :
China
Brand Name :
OEM
Supply Ability :
100pcs per month
Packaging Details :
Standard Export Packing
MOQ :
1 unit
Price :
Negotiable
Contact Supplier
Automatic 12 Chip Head 1200KG PCB Surface Mounting Machine
Automatic 12 Chip Head 1200KG PCB Surface Mounting Machine
Automatic 12 Chip Head 1200KG PCB Surface Mounting Machine

Beijing Silk Road Enterprise Management Services Co.,LTD

Verified Supplier
5 Years
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Agent, Importer, Exporter
Main Products :
SMT Mounting Machine, Chip Mounting Machine, LED Mounting Machine
Employee Number :
400~500
Certification Level :
Verified Supplier
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