Copper Plate Sheet C11000 CU-ETP / CW004A Flat Plates Good Surface and Smooth Edge
Products Specification
Copper Sheet,Copper Plate
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Material
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C10100,C10200,C10300,C10400,C10500,C10700,C10800,C10910,C10920,
C10930,C11000,C11300,C11400,C11500,C11600,C12000,C12200,C12300, C12500,C14200,C14420,C14500,C14510,C14520,C14530,C17200,C19200, C21000,C23000,C26000,C27000,C27400,C28000,C33000,C33200,C37000, C44300,C44400,C44500,C60800,C63020,C65500,C68700,C70400,C70600, C70620,C71000,C71500,C71520,C71640,C72200,etc. |
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Specifications
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Thickness
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0.1mm-200mm
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Width
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10mm-2500mm
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Length
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10mm~12000mm,or as required.
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Price Term
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Ex-work, FOB, CFR, CIF, etc.
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Payment Term
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T/T, L/C, Western Union, etc.
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Delivery Time
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According to order's quantity.
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MOQ
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100Kgs.
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Export To
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Singapore,Indonesia,Ukraine,Korea,Thailand, Viet Nam, Saudi Arabia, Brazil,
Spain, Canada, USA, Egypt, India, Kuwait, Dubai, Oman, Kuwait, Peru, Mexico, Iraq,Russia,Malaysia, etc. |
Pure copper appearance is purplish red, commonly known as "red copper", "red copper" or "red copper".Pure copper conducts electricity very well, ranking second only to silver among all metals, so it is used very widely in industry.T2 is a typical grade of pure copper, usually referring to red copper, or T2 unless otherwise specified.
STANDARDS:
CHINA |
GB/T 5231-2012 GB/T 2529-2012 |
T2,T11050 |
USA | ASTM B187-2006 | C11000 |
JAPAN |
JIS H3100:2006 JIS H3140:2006[TJC STEEL] JIS H3250:2006 |
C1100 |
GERMANY | DIN 1787:1973 | E-Cu58,2.0065 |
DIN CEN/TS 13388:2008 | Cu-ETP,CW004A |
CHEMICAL COMPOSITION(%):
GRADE | T2 | C11000 | C1100 | CW004A |
Cu | ≥99.90 | ≥99.90 | ≥99.90 | ≥99.90 |
Ag | — | ≤0.03 | ||
Bi | ≤0.001 | — | — | ≤0.0005 |
Sb | ≤0.002 | — | — | — |
As | ≤0.002 | — | — | — |
Fe | ≤0.005 | — | — | — |
Pb | ≤0.005[TJC STEEL] | — | — | ≤0.005 |
S | ≤0.005 | — | — | — |
O | — | — | — | ≤0.040 |
PERFORMANCE CHARACTERISTICS:
1. Excellent electrical and thermal conductivity, good ductility, deep drawing performance, corrosion resistance and atmospheric corrosion performance, can be welded and brazed.
2. Trace amount of oxygen is easy to cause "hydrogen embrittlement", not suitable for processing and use in high temperature (such as BBB 0 370℃) reducing atmosphere.
Application of Cu-ETP Copper Plate Sheet
Cu-ETP has the advantages of electric conduction and heat conduction of pure copper, and is widely used, such as wire and cable, sealing gasket, hardware, mold electrode, etc.