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IC Bonding Machine
IC Bonding Machine
IC Bonding Machine
IC Bonding Machine
Specifications
Brand Name :
Suneast
Model Number :
WBD2200 | WBD2200 Plus | CBD2200 | CBD2200 EVO | SDB 200
Certification :
CE、ISO
Place of Origin :
Shenzhen, Guangdong Province, China
MOQ :
≥1 pc
Price :
Negotiable
Payment Terms :
T/T
Delivery Time :
25~50 days
Packaging Details :
Plywood crate
Description

IC Bonding Machine

The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture.

IC bonder is suit able for IC,WLCSP,TSV, SIP,QFN,LGA,BGA process products. Such as optical communication module, camera module, LED, power module, power device, vehicle electronics, 5G RF, memory, MEMS, various sensors, etc.

IC Bonder Machine

IC Bonding Machine IC Bonding Machine IC Bonding Machine

IC Bonding Machine

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IC Bonding Machine

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Product Detail
Brand Name :
Suneast
Model Number :
WBD2200 | WBD2200 Plus | CBD2200 | CBD2200 EVO | SDB 200
Certification :
CE、ISO
Place of Origin :
Shenzhen, Guangdong Province, China
MOQ :
≥1 pc
Price :
Negotiable
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IC Bonding Machine
IC Bonding Machine

Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

Verified Supplier
1 Years
guangdong, shenzhen
Since 1984
Business Type :
Manufacturer
Main Products :
Wave Soldering Machines, Reflow Soldering Oven, Selective Wave Soldering Machine
Total Annual :
30000000-45000000
Employee Number :
300~500
Certification Level :
Verified Supplier
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