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High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine
High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine
High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine
High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine
Specifications
Brand Name :
Suneast
Model Number :
CBD2200 EVO
Certification :
CE、ISO
Place of Origin :
Shenzhen, Guangdong Province, China
MOQ :
≥1 pc
Price :
Negotiable
Payment Terms :
T/T,
Delivery Time :
25~50 days
Packaging Details :
Plywood crate
Name :
IC Bonder
Model :
CBD2200 EVO
Machine dimension :
1400(L)*1250(W)*1700(H)mm
Weight :
Approx.1500Kg
Placement accuracy :
≤±10um@3σ
Placement angle accuracy :
±0.15°@3σ
Substrate pallet size :
L200 X W90~150mm
Core module movement mode :
Linear motor + grating scale
Glue feeding mode :
Dispensing + painting glue
Customizable :
Yes
Description

Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design

Features:

  • High speed, accurate solidification capacity ±10um@3σ;
  • High production efficiency, low cost input
  • High multi-chip processing capacity, support 16 different types of chip placement
  • High flexibility to support multiple carrier operations
  • Can work in different plane heights, support deep cavity work
  • Modular platform design, small appearance, small footprint

Product advantage:

High precision

Accuracy: ±10μm@3σ

Angle: ±0.15°@3σ

High precision linear motor

 High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

Waffle pack / Gel-Pak

Supports 16 Waffle packs (2 "x 2")

4”x 4”size is available.

 High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

Automatic height measurement

Accuracy: 3μm

Supports a variety of probes

Can be replaced with laser

altimeter according to demand

 High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

Nozzle station

Quick automatic nozzle change

Supports 7 nozzle stations.

 High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

Visual recognition

2448x2048 resolution

256 gray level

Support gray value template,

custom shape template

The platform can be positioned twice.

The Angle error is ±0.01deg.

 High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

Deep cavity operation

Work at different plat heights.

The maximum depth is 11mm.

 High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

Features of dispensing function:

  • Supports various types of epoxy adhesives
  • Meet various graphic dispensing needs
  • Comes with commonly used standard graphics library
  • Support custom graphics library

Product parameters:

Item Specification
Placement accuracy ≤±10um@3σ
Placement angle accuracy ±0.15°@3σ
Force control range 20~1000g(with different configurations, the maximum support is 7500g)
Force control accuracy 20g-150g:± 2g@3σ 150g-1000g:±5%@3σ
Substrate pallet size(mm) L200 X W90~150
Tray size(mm) Based on customer products
Loading/Unloading Manual / auto
IC dimension(mm) L0.25X W0.25—L10 X W10
IC supply Waffle tray
Core module movement mode Linear motor + grating scale
Glue feeding mode Dispensing + painting glue
Auto change nozzle Seven
Bottom photo-taking Equipped with camera
Machine dimension(mm) L(1400)*W(1250)*H(1700)
Weight Net weight of equipment:Approx.1500Kg

Notices:

1.Leakage protection switch: ≥100ma

2.Compressed air requirement: 0.4-0.6Mpa

Inlet pipe specification: Ø10mm

3.Vacuum requirement:<-88kPa

Inlet pipe specification: Ø10mm

Tracheal joint: 2 pieces

4.Power requirements:

①Voltage: AC220V, frequency 50/60HZ

②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA

5.The ground is required to withstand a pressure of 800kg/m².

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High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

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Product Detail
Brand Name :
Suneast
Model Number :
CBD2200 EVO
Certification :
CE、ISO
Place of Origin :
Shenzhen, Guangdong Province, China
MOQ :
≥1 pc
Price :
Negotiable
Contact Supplier
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High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine
High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

Verified Supplier
1 Years
guangdong, shenzhen
Since 1984
Business Type :
Manufacturer
Main Products :
Wave Soldering Machines, Reflow Soldering Oven, Selective Wave Soldering Machine
Total Annual :
30000000-45000000
Employee Number :
300~500
Certification Level :
Verified Supplier
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