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Sintering Die Bonder SDB 200
Sintering Die Bonder SDB 200
Specifications
Brand Name :
Suneast
Model Number :
SDB200
Certification :
CE、ISO
Place of Origin :
Shenzhen, Guangdong Province, China
MOQ :
≥1 pc
Price :
Negotiable
Payment Terms :
T/T
Delivery Time :
25~50 days
Packaging Details :
Plywood crate
Model :
SDB 200
Machine dimension :
1050(L)*1065(W)*1510(H)mm
Equipment net weight :
Approx.900kg
Placement accuracy :
±10um
Placement angle deviation :
±1°
Placement head heating temp :
Max.200℃
Placement head rotation angle :
Max.345°
PCB loading method :
Manual
Core motion module :
Linear motor+grating scale
Customizable :
Yes
Description

Automatic Compact Structure Sintering Die Bonder SDB200 Wafer Loading

Introduction:

It is designed for power semiconductor IC bonding market, equipped with more powerful BONDHEAD system, which possesses functions like high precision bonding, pressure holding circuit maintaining and heating, achieving the presintering bonding of electric components for high precision heating system.

Features:

  • Die bonding ability with high speed and high accuracy
  • Placement head and platform with heating function
  • Temperature control system with high accuracy
  • Accurate force control system
  • Wafer loading support
  • Automatic nozzle change
  • Automatic pin base change
  • Compact structure and small occupying area

Product Advantage:

High precision

Placement accuracy: ±10um

Rotation accuracy:±0.15°

 Sintering Die Bonder SDB 200

Stable motion

Compact structure and self-developed gravity balance system make motion stable

 Sintering Die Bonder SDB 200

Wafer loading

8 inches wafer standard support

 Sintering Die Bonder SDB 200

Nozzle base

Nozzle auto-change with 5 nozzles

 Sintering Die Bonder SDB 200

Main application:

Presintering die bonder is suit able for IGBT, SiC, DTS, resistance and other high temperature

presintering processes. It is mainly used in power module, power supply module, new energy,

smart grid and other industry areas.

Product Parameters:

Item Specification
Placement accuracy(um) ±10
Rotation accuracy(@3sigma) ±0.15°
Placement angle deviation ±1°
Placement Z axis force control(g) 50-10000
Force control accuracy(g)

50-250g, repeatability ±10g；

250g-8000g, repeatability ±10%；
Placement head heating temp Max. 200℃
Placement head rotation angle Max. 345°
Placement heat cooling air/nitrogen cooling
Chip size(mm) 0.2*0.2～20*20
Wafer size(inch) 8
Placement workbench heating temp Max. 200℃
Placement workbench heating zone temp deviation ＜5℃
Placement workbench available size(mm) 380×110
Max. Placement head XYZ axis stroke(mm) 300x510x70
Equipment repaceable nozzle number 5
Equipment replacement Pin module number 5
PCB loading method Manual
Wafer loading Method Semi-auto(manually place wafer cassette, automatically take wafer)
Core motion module Linear motor+grating scale
Machine platform base Marble platform
Machine main body dimension(L×W×H, mm) 1050X 1065 X 1510
Equipment net weight Approx.900kg

Notices:

1,Leakage protection switch: ≥100ma

2,Compressed air requirement: 0.4-0.6Mpa

Inlet pipe specification: Ø10mm

3,Vacuum requirement:<-88kPa

Inlet pipe specification: Ø10mm

Tracheal joint: 2 pieces

4,Power requirements:

①Voltage: AC220V, frequency 50/60HZ

②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA

5,The ground is required to withstand a pressure of 800kg/m²

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Sintering Die Bonder SDB 200

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Product Detail
Brand Name :
Suneast
Model Number :
SDB200
Certification :
CE、ISO
Place of Origin :
Shenzhen, Guangdong Province, China
MOQ :
≥1 pc
Price :
Negotiable
Contact Supplier
video
Sintering Die Bonder SDB 200

Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

Verified Supplier
1 Years
guangdong, shenzhen
Since 1984
Business Type :
Manufacturer
Main Products :
Wave Soldering Machines, Reflow Soldering Oven, Selective Wave Soldering Machine
Total Annual :
30000000-45000000
Employee Number :
300~500
Certification Level :
Verified Supplier
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