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High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders
High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders
High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders
High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders
Specifications
Brand Name :
Suneast
Model Number :
WBD2200 PLUS
Certification :
CE、ISO
Place of Origin :
Shenzhen, Guangdong Province, China
MOQ :
≥1 pc
Price :
Negotiable
Payment Terms :
T/T
Delivery Time :
25~50 days
Packaging Details :
Plywood crate
Name :
IC Bonder
Model :
WBD2200 PLUS
Machine dimension :
2480(L)*1470(W)*1700(H)mm
Placement accuracy :
≤±15um@3σ
Placement angle accuracy :
±0.3 °@3σ
Die size :
0.25*0.25mm-10*10mm
Core module movement mode :
Linear motor + grating scale
Glue feeding mode :
Dispensing + painting glue
Loading / Unloading :
Manual / auto
Customizable :
Yes
Description

Automatic Nozzle Change High Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers

General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes.

Features:

  • Multilayer capability
  • Automatic nozzle change
  • Supermini chip placement
  • Compatible with 8-12 inch wafers
  • Ultrathin die bonding technology
  • Bottom photo-taking, high precision placement
  • Automatic loading and unloading
  • Automatic wafer change

Main application:

It is suitable for mass wafer loading products, and for SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. It is mainly used in automotive electronics, medical electronics, optoelectronics, mobile phones and other industries.

Product advantage:

High precision

Accuracy :±15μm@3σ

Angle: Die size: > 1 x 1 mm ±0.3°@3σ

Die size: < 1 x 1 mm ±1°@3σ

 High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

Material box loading

Fully automatic feeding and discharging Warehouse processing system, supported by SMEMA online communication agreement,support the SECS/GEM protocol

 High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

Stacking loading

Multiple feeding methods, compatible with stacking feeding function, improving customer selectivity

 High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

Nozzle station

Equipped with a fully automatic wafer loading and unloading processing system, support to the SECS/GEM protocol

 High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

Visual recognition

2448x2048 resolution

256 gray levels

Support gray value template, custom shape template

The platform can be positioned twice

The angle error is ±0.01deg

 High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

Real-time compensation

It can detect the image after bonding and do automatic real-time compensation to ensure stable mounting accuracy

 High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

Product Parameters:

Item Specification
Placement accuracy ±15um@3σ
Placement angle accuracy ±0.3°@3σ
Force control range 20~1000g(with different configurations, the maximum support is 7500g)
Force control accuracy 20g-150g:± 2g@3σ 150g-1000g:±5%@3σ
Silicon wafer processing(mm) Maximum 12“(300mm) Compatible 8”(150mm)
Die size(mm) 0.25*0.25mm-10*10mm
Loading / Unloading Manual / auto
Applicable material box(mm) L 110-310; W 20-110; H 70-153
Applicable lead frame(mm) L 100-300; W38-100; H 0.1-0.8
Core module movement mode Linear motor + grating scale
Glue feeding mode Dispensing + painting glue
Bottom photo-taking Option
Machine dimension(mm) L(2480)*W(1470)*H(1700)
Weight Net weight of equipment:Approx.1800Kg

Notices:

1.Leakage protection switch: ≥100ma

2.Compressed air requirement: 0.4-0.6Mpa

Inlet pipe specification: Ø10mm

3.Vacuum requirement:<-88kPa

Inlet pipe specification: Ø10mm

Tracheal joint: 2 pieces

4.Power requirements:

①Voltage: AC220V, frequency 50/60HZ;

②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA.

5.The ground is required to withstand a pressure of 800kg/m²

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High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

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Product Detail
Brand Name :
Suneast
Model Number :
WBD2200 PLUS
Certification :
CE、ISO
Place of Origin :
Shenzhen, Guangdong Province, China
MOQ :
≥1 pc
Price :
Negotiable
Contact Supplier
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High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders
High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

Verified Supplier
1 Years
guangdong, shenzhen
Since 1984
Business Type :
Manufacturer
Main Products :
Wave Soldering Machines, Reflow Soldering Oven, Selective Wave Soldering Machine
Total Annual :
30000000-45000000
Employee Number :
300~500
Certification Level :
Verified Supplier
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