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Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine
Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine
Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine
Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine
Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine
Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine
Specifications
Brand Name :
Suneast
Model Number :
CBD2200
Certification :
CE、ISO
Place of Origin :
Shenzhen, Guangdong Province, China
MOQ :
≥1 pc
Price :
Negotiable
Payment Terms :
T/T
Delivery Time :
25~50 days
Packaging Details :
Plywood crate
Name :
IC Bonder
Model :
CBD2200
Machine dimension :
1610(L)*1380(W)*1620(H)mm
Placement accuracy :
±10um@3σ
Placement angle accuracy :
±0.3°@3σ
Die size :
0.25*0.25mm-10*10mm
Substrate size :
L300*W100
Placement pressure :
30-500g
Glue feeding mode :
Dispensing, dipping, painting
Customizable :
Yes
Description

Supermini Chip Placement Quick Changeover IC Bonder CBD2200

Special use type high precision IC bonder, for a variety of small batch of placement products. It can automatically switch to a variety of bonding heads, and quickly realize the placement of different parameters of a variety of chips.

Features:

  • Supermini chip placement
  • Ultrathin die bonding technology
  • Automatic nozzle change
  • Bottom photo-taking, high precision placement
  • Quick changeover

Main application:

It is suitable for a variety of small batch of placing products, automatically switch to a variety of mounting head, quickly achieve to place a variety of chip with different. It is mainly used in the military products RF and power module power amplifier.

Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine

Product Parameters:

Item Specification
Placement accuracy ±10um@3σ
Placement angle accuracy ±0.3°@3σ
Loading mode Wafer box
Die size(mm) 0.25*0.25mm-10*10mm
PCB size(mm) L300*W100
Placement head 0-360°rotation/Auto change nozzle(option)
Placement pressure(N) 30-500g
Glue feeding mode Support: dispensing, dipping, painting
Core motion module Linear motor + grating scale
Platform base of machine Marble platform
Machine dimension(L×W×H) 1610mm×1380mm×1620mm

Notices:

1.Leakage protection switch: ≥100ma

2.Compressed air requirement: 0.4-0.6Mpa

Inlet pipe specification: Ø10mm

3.Vacuum requirement:<-88kPa

Inlet pipe specification: Ø10mm

Tracheal joint: 2 pieces

4.Power requirements:

①Voltage: AC220V, frequency 50/60HZ

②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA.

5.The ground is required to withstand a pressure of 800kg/m².

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Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine

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Product Detail
Brand Name :
Suneast
Model Number :
CBD2200
Certification :
CE、ISO
Place of Origin :
Shenzhen, Guangdong Province, China
MOQ :
≥1 pc
Price :
Negotiable
Contact Supplier
video
Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine
Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine
Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine

Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

Verified Supplier
1 Years
guangdong, shenzhen
Since 1984
Business Type :
Manufacturer
Main Products :
Wave Soldering Machines, Reflow Soldering Oven, Selective Wave Soldering Machine
Total Annual :
30000000-45000000
Employee Number :
300~500
Certification Level :
Verified Supplier
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