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Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
Specifications
Brand Name :
Suneast
Model Number :
WBD2200
Certification :
CE、ISO
Place of Origin :
Shenzhen, Guangdong Province, China
MOQ :
≥1 pc
Price :
Negotiable
Payment Terms :
T/T
Delivery Time :
25~50 days
Packaging Details :
Plywood crate
Name :
IC Bonder
Model :
WBD2200
Machine dimension :
1255(L)*1625(W)*1610(H)mm
Placement accuracy :
±15um@3σ
Die size :
0.25*0.25mm-10*10mm
Substrate size :
150(L)*50(W)~300(L)*100(W)mm
Substrate thickness :
0.1~2mm
Placement pressure :
30～7500g
Glue feeding mode :
dispensing，dipping glue，painting glue
Customizable :
Yes
Description

High Precision Multilayer Capability Quick Changeover IC Bonding Machine WBD2200

The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture.

Features:

  • Multilayer Capability
  • System-in-Package Capability
  • Ultrathin Die Bonding Technology
  • Supermini Chip Bonding
  • Quick Changeover

Main application:

IC bonder is suit able for IC,WLCSP,TSV, SIP,QFN,LGA,BGA process products. Such as optical communication module, camera module, LED, power module, power de vice, vehicle electronics, 5G RF, memory, MEMS, various sensors, etc.

Product Parameters:

Item Specification
Placement accuracy ±15um@3σ
Wafer size(mm) 4"/6"/8"(Option:12")
Die size(mm) 0.25*0.25mm-10*10mm
Substrate size(mm) L150×W50~L300×W100
Substrate thickness(mm) 0.1~2mm
Placement head 0-360°rotation/Auto change nozzle(option)
Placement pressure(N) 30～7500g
Glue feeding mode Support:dispensing,dipping glue,painting glue
Core motion module Linear motor + grating scale
Platform base of machine Marble platform
Loading/unloading Manual/auto
Machine dimension(L×W×H) 1255mm×1625mm×1610mm

Notices:

1.Leakage protection switch: ≥100ma

2.Compressed air requirement: 0.4-0.6Mpa

Inlet pipe specification: Ø10mm

3.Vacuum requirement:<-88kPa

Inlet pipe specification: Ø10mm

Tracheal joint: 2 pieces

4.Power requirements:

①Voltage: AC220V, frequency 50/60HZ;

②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA.

5.The ground is required to withstand a pressure of 800kg/m².

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Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment

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Product Detail
Brand Name :
Suneast
Model Number :
WBD2200
Certification :
CE、ISO
Place of Origin :
Shenzhen, Guangdong Province, China
MOQ :
≥1 pc
Price :
Negotiable
Contact Supplier
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Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment

Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

Verified Supplier
1 Years
guangdong, shenzhen
Since 1984
Business Type :
Manufacturer
Main Products :
Wave Soldering Machines, Reflow Soldering Oven, Selective Wave Soldering Machine
Total Annual :
30000000-45000000
Employee Number :
300~500
Certification Level :
Verified Supplier
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