Stable Printing Quality SL120 Full Automatic Screen Printing Machines
Solder paste printing machines are mainly used to print solder paste on the surface of circuit boards (PCBs). Apply solder paste evenly onto the solder pads of the circuit board using tools such as scrapers, providing precise and uniform solder paste distribution for subsequent electronic component soldering. The solder paste printing machine can accurately control the coating position and thickness of solder paste through a high-precision motion control system, ensuring the soldering quality between electronic components and PCBs. Solder paste printing machines are widely used in SMT surface mount production lines in the electronic manufacturing industry.
Features:
Overall diagram:
1 Machine housing module
2 CCD image capture module
3 Stencil lifting module of Z-axis
4 Squeegee printing module
5 Cleaning module
6 Platform fine adjustment module
7 Rail and conveyor module
8 Three color warning lamp
9 Display and input device
Product Parameters:
Basic Parameters | Screen Frame Size | 1000(X)×300(Y)—1500(X)×650(Y) (mm) |
Thickness:20-40mm | ||
Min PCB(mm) | 80(X)×50(Y) (mm) | |
Max PCB(mm) | 1200(X)×360(Y) (mm) | |
Thickness | 0.2mm~6mm(Use jig when pcb less than 0.4mm) | |
Curve | <1%(Diagonal measurement) | |
PCB Backside Part Height | 15mm | |
Conveyor Height | 900±40mm | |
Support | Magnetic support, Magnetic piece, Vacuum chamber(Option) | |
Clamp | Side clamp and top clamp | |
Edge Distance | PCB process edge≥2.5mm,without PCB edge(option) | |
Conveyor Speed | 0~1500mm/sec, increment 1mm | |
Conveyor Belt | U type sync belt | |
Stopper method | Air Cylinder | |
Stopper position | Set the PCB stopper position according to the size of board | |
Flow direction | Set by software | |
Print System | Print Speed | 5-200mm/s adjustable |
Print Head | Step motor drive scraper lifting | |
Scraper | Steel scraper,rubber scraper(option) | |
Scraper Angle | 60° | |
Scraper Pressure | 0~20kg | |
Vision System | Substrate Separation | Three-section Substrate Separation speed:0.1-20mm/s distance:0-20mm |
Alignment Position method | Mark automatic alignment | |
Camera | Germany BASLER,1/3”CCD,640*480pixel,pixel size:5.6μmx5.6μm | |
Acquire image method | Up/under double photo | |
Camera Light | Coaxial light, Ring light four kinds light can adjustable | |
View Range | 9mm*7mm | |
Mark dimensions | Diameter or Side length 1mm~2mm,allowable offset 10% | |
Mark Shape | Cir, Rec, or rhombus etc | |
Mark Position | PCB dedicated mark or PCB pad | |
2D detection | Standard | |
Accuracy | Table Adjustment Range | X=±10mm,Y=±10mm, θ=±1.5° |
Positional Accuracy | ±0.01mm | |
Printing Accuracy | ±0.025mm | |
Time | Cycle Time | <10s (ex print, cleaning time) |
Convert line Time | <5min | |
Programming Time | <10min | |
Control System | Computer Configuration | Industrial PC,Windows official system |
System Language | Chinese,English | |
Pre and next machine Connection | SMEMA | |
User authorization | User PW and Senior PW set | |
Cleaning System | Cleaning System | Dry and Wet, vacuum model |
Liquid Level Detection | Liquid level auto alarm detection | |
Power Parameters | Main Power Supply | AC 220V±10% 50/60HZ Single phase |
Total Power | Approx.3kw | |
Main Air Supply | 4.5~6kgf/cm2 | |
Machine Weight | Approx.1500Kg | |
Machine Dimension | 2350(L)x1350(W)x1590(H)mm | |
Option | Pneumatic Top Clamp | Standard |
Top clamp + side clamp | For PCB(thickness≤1mm) | |
Vacuum Adsorption and unloading | For PCB(thickness≤1mm) and FPC | |
Auto tin added | / | |
Auto Loading and Unloading | / | |
Flexible and Universal Support | For the double-sided PCB(PCB backside parts Height≤9mm) | |
Automatic Positioning of screen frame | / | |
PCB Thickness Auto Adjustment Function | Standard | |
Squeegee Pressure Feedback Function | / | |
Air conditioner | Customer can buy by themselves | |
The rest of Solder Paste on the stencil Monitoring System | / | |
SPI close loop | SPI close loop | |
UPS power off protection | UPS 15min power off protection | |
Industry 4.0 | Bar code trace function, production analysis etc |
Notices:
1.Gas source requirements: 4.5-6kgf/cm²; Inlet pipe Ø≥8mm.
2.Power requirements: single-phase AC 220V±10% 50/60HZ, power cord with 4-6mm², equipped with a 16A well grounded socket.
3.Ground pressure requirement: 1000kg/m².
4.During the installation period, arrange 2-3 people to learn and conduct training assessments.