Suntek Group is a leading supplier in EMS field with one-stop solution for PCB/FPC

assembly,Cable assembly,Mix technology assembly and Box-buildings.

Suntek Electronics Co., Ltd,as the major facility, located in Hunan Prov,China;

BLSuntek Electronics Co., Ltd,as the new facility,located in Kandal Prov,Cambodia.

Capabilities overview:

Communication device PCBs facilitate interconnections between active and passive components using conductive copper traces etched from copper-clad laminate boards. They provide mechanical support and the necessary electrical connections dictated by the intended functioning of the device. But most importantly, PCBs designed for communications applications must transmit signals accurately and reliably between components, without unacceptable loss or interference. This requires specialized materials and fabrication processes to serve the unique demands of high-frequency communication electronics.

At JHYPCB, we have rich expertise in manufacturing PCBs for all kinds of communication devices, from consumer electronics to telecom infrastructure. Leveraging over a decade of experience serving major brands globally, we fully understand the stringent requirements and can reliably produce communication PCBs for the most demanding applications. Whether prototyping bleeding-edge designs or volume production of complex boards, we have the capabilities to deliver.

Communication is the most important downstream application field of PCB. PCB has a wide range of applications in various aspects such as wireless network, transmission network, data communication and fixed network broadband, and it is usually added value such as backplane, high-frequency high-speed board, and multi-layer PCB board. Higher product. 5G is the next generation mobile communication network, and there will be a large amount of infrastructure construction demand by then, which is expected to greatly boost the demand for communication boards.

Here are the most common applications of the telecommunication industry that make efficient use of PCBs:

• Wireless communication systems
• Mobile phone tower systems
• Telephonic switching systems
• PBX systems
• Industrial wireless communication technology
• Technology for commercial phones
• Video conferencing technologies
• Communication technology used in space
• Cell transmission and tower electronics
• High speed servers and routers
• Electronic data storage devices
• Mobile communication systems
• Satellite systems and communication devices
• Video collaboration systems
• Land wired communication systems
• Technology for commercial phones
• Digital and analog broadcasting systems
• Voice over Internet Protocol (VoIP)
• Signal boost systems (online)
• Security technology and information communication systems

PCB Requirements

Communication devices require PCBs to provide robust and reliable connectivity solutions for complex high speed components. Signal integrity needs to be maintained as signals travel between transceivers, antennas, power amplifiers and more. These requirements generally include:

• High-Frequency Performance
  Many communication device signals operate at high frequencies in the microwave band. For example, smartphones incorporate multiband antennas that support 4G and 5G frequency bands – 700 MHz to 5 GHz for the latest generation. This requires PCB materials and construction to enable proper signal transmission without degradation through dielectric power loss or leaky RF conduction paths. We carefully select substrates and lamination materials tailored for high frequency operation based on dielectric constant, loss tangent, thermal conductivity, TCE and other parameters.
• High Speed Signal Handling
  In addition to frequency, data rate throughput capacity is equally important. Cutting-edge phones with multi-Gbps Wi-Fi 6 speeds, high bandwidth wireless interfaces need PCBs with fine line traces and spaces (4-6 mil line/space is common for data lines). Short signal paths routed close together require low loss, tight impedance tolerance laminates as well as careful stackups for characteristic impedance control. And a robust power distribution network is key for clean power delivery to signal ICs and FPGAs operating at high clock rates. We design layer counts, trace dimensions, dielectrics and laminate materials specifically to maintain signal integrity in high speed signal paths.
• EMI and Crosstalk Prevention
  With complex components in close proximity and interacting at high frequencies, communication PCBs must prevent unwanted coupling between traces. Short signal return paths, reference planes and proper component placement facilitate field confinement. Our engineers utilize careful stackup symmetry, selective isolation/shielding around sensitive components, ground stitching vias alongside traces, and special treatments to eliminate EMI emission and minimize crosstalk in dense layouts with high speed traces throughout multilayer boards.