Custom Communication PCB Assembly for Backplane High-Frequency and Multi-Layer Boards Suntek Group
Suntek Contract Factory:
Located in Development Zone-Changsha City, Suntek is one of the leading suppliers of EMS and has been providing support in PCB assembly and cable assembly field for more than 10 years. With ISO 9001:2015,ISO13485,IATF16949 and UL certified,we supply qualified products with competitive prices to clients all over the world.
Capabilities overview:
Product Name | PCB Assembly |
PCBA Test | AOI, X-RAY, ICT, Function Test |
PCB Assembly Method | BGA |
Minimum Hole Tolerance | ±0.05mm |
Layers | 2-10 |
PCB Thickness | 0.2-7.0mm |
Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
PCB Process | Immersion Gold |
PCB Quality System | ROHS |
Min. Line Width/Spacing | 0.1mm |
Surface Finish | ENIG |
With the rapid development of information and communication technologies, electronic devices like smartphones, wireless routers, base stations and other communication equipment have become indispensable in daily life and work. The printed circuit boards in these devices serve as the foundation for assembly of components and integrated circuits, enabling the transmission of high-speed signals and data that make communication possible.
Communication device PCBs facilitate interconnections between active and passive components using conductive copper traces etched from copper-clad laminate boards. They provide mechanical support and the necessary electrical connections dictated by the intended functioning of the device. But most importantly, PCBs designed for communications applications must transmit signals accurately and reliably between components, without unacceptable loss or interference. This requires specialized materials and fabrication processes to serve the unique demands of high-frequency communication electronics.
Communication is the most important downstream application field of PCB. PCB has a wide range of applications in various aspects such as wireless network, transmission network, data communication and fixed network broadband, and it is usually added value such as backplane, high-frequency high-speed board, and multi-layer PCB board. Higher product. 5G is the next generation mobile communication network, and there will be a large amount of infrastructure construction demand by then, which is expected to greatly boost the demand for communication boards.
Here are the most common applications of the telecommunication industry that make efficient use of PCBs:
While special substrates like polyimides and ceramics handle wider temperature swings, FR-4 laminates have evolved “high Tg” versions usable to 150°C+ along with lower cost and better fabricator familiarity. So FR-4 remains an option for many industrial applications not hitting extreme temps.