PCB Laser Depaneling,PCB Depaneling,Circuit Boards PCBA Separator,SMTfly-LJ330

Description:

Neat and smooth edge, no burr or overflow

Wide application range, including FPC exterior cutting, profile cutting, drilling, opening window for

covering, etc. Laser wavelength: 355nm

Rated power: 10W/15W@30KHz

Galvanometer working field Per One Process: 30 × 30mm

Power consumption for the hole machine: 2KW

PCB Laser Depaneling,PCB Depaneling,Circuit Boards PCBA Separator Specification

Laser Q-Switched diode-pumped all solid-state UV laser

Laser Wavelength 355nm

Laser Source Optowave UV 10W/12W/15W/17W@30KHz

Positioning Precision of Worktable of

Linear Motor

±2μm

Repetition Precision of Worktable of

Linear Motor

±1μm

Effective Working Field 300mmX300mm(Dual Tables)

Spot diameter 20±5μm

Working temperature/humidity 20±2 ℃/＜60 %

Machine Dimension 1250mm*1300mm*1600mm

Machine Weight 1500KG

PCB Laser Depaneling,PCB Depaneling,Circuit Boards PCBA Separator Features

1). High-precision: Low-drift galvanometer combined with fast ironless linear motor system platform for fast cutting. Keep high precision in micrometers.

2). Easy to learn: Self-developed Windows control system, easy-to-use Chinese/English interface, and friendly Views, powerful and diverse, easy to operate.

3). Intelligent Automated: Using high-precision CCD to automatically locate and focus, positioning is fast and accurate, without manual intervention, simple operation, realize the one-button mode of the same type, greatly improve production efficiency. Automatic galvanometer correction, auto focus, full implementation Automation, using laser displacement sensor to automatically adjust the height of the focus to the table, to achieve rapid alignment, saving time.

4). Suitable for cutting: FPC, PCB, chip cutting, cell phone camera module. Fragments, layers, blocks, or selected areas are cut and formed directly. The cutting edges are neat, smooth, smooth, and free of burrs. Overfilled plastic. Products can be arranged in a matrix for automatic positioning and cutting, especially for fine, difficult and complex patterns .

5). High-performance lasers: Adopting solid-state UV lasers from international brands, with good beam quality and focused spot. Small, uniform power distribution, small thermal effect, small kerf width, high cutting quality, etc.

Cutting Application

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.

Samples After PCB Laser Depaneling Machine