Product Description
Layer | 1L | |||
Material | AL 1W | |||
Board Thickness | 1.6 MM | |||
Copper Thickness | 1oz | |||
Surface treatment | Immersion Gold 2U" | |||
Special Feature | Large area immersed in gold |
About TECircuit
Found: TECircuit has been operating since 2004.
Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.
Item: Customizable EMS PCB, offers a full range of one-stop shop services.
Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.
Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.
Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2
Product Description
Specification: | |||||
PCB layers: | 1-42layers | ||||
PCB materials: | CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free | ||||
PCB max. board size: | 620mm*1100mm | ||||
PCB certificate: | RoHS Directive-Compliant | ||||
PCB Thickness: | 1.6 ±0.1mm | ||||
Out Layer Copper Thickness: | 0.5-5oz | ||||
Inner Layer Copper Thickness: | 0.5-4oz | ||||
PCB max. board thickness: | 6.0mm | ||||
Minimum Hole Size: | 0.20mm | ||||
Minimum Line Width/Space: | 3/3mil | ||||
Min. S/M Pitch: | 0.1mm(4mil) | ||||
Plate Thickness and Aperture Ratio : | 30:1 | ||||
Minimum Hole Copper: | 20µm | ||||
Hole Dia. Tolerance(PTH): | ±0.075mm(3mil) | ||||
Hole dia. Tolerance(NPTH): | ±0.05mm (2mil) | ||||
Hole Position Deviation: | ±0.05mm (2mil) | ||||
Outline Tolerance: | ±0.05mm (2mil) | ||||
PCB solder mask: | Black, white, yellow | ||||
PCB surface finished: | HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver | ||||
Legend: | White | ||||
E-test: | 100% AOI, X-ray, Flying probe test. | ||||
Outline: | Rout and Score/V-cut | ||||
Inspection Standard: | IPC-A-610CCLASSII | ||||
Certificates: | UL (E503048),ISO9001/ISO14001/IATF16949 | ||||
Outgoing Reports: | Final Inspection, E-test, Solderability Test, Micro Section and More |