Microprocessor Programmable Constant Rapid Change Temperature Cyclic Test Chamber

Rapid change temperature testing specifies a test sample temperature variation rate of 15°C/minute or less, which is the biggest difference between this method and thermal shock testing. Since rapid change temperature testing achieves highly repeatable test results, it is used for compliance testing for standards such as JEDEC (JESD 22-A104B).

Rapid change temperature testing is a type of thermal cycling tests developed to improve the failure repeatability of thermal shock tests.

With the ongoing rise in issues affecting the reliability of electronic devices and circuit boards, a better-suited evaluation testing method is needed to respond to issues such as higher device operation temperatures resulting from greater semiconductor integration, changes in device mounting methods such as BGA and CSP, and the use of lead-free solder.

Choose a Correct Chamber Dimension:

Choosing a correct chamber size depends on the application and your available floor space. The suggested ratio is about 1:3 between product volume and the working volume of the chamber.

⅓ product to ⅔ empty space around the product ensures adequate airflow to the test sample and makes sure your test is conducted properly. Items that allow for airflow (such as a computer chassis with plenty of air vents) can take up a larger percentage of the test volume.

Features:

1, Available internal chamber volumes: 150L, 225L, 416L, 800L and 1000L;

2, To preset different heating and cooling rate: 5℃/min, 10℃/min, 15℃/min;

3, Support rapid change temperature test, condensation test, high temperature/humidity test, temperature/humidity loop test, etc.

4, Complete real time curve display;

5, Conform but not limited standards: MIL-STD-2164, MIL-344A-4-16, GJB-1032-90, GJB/Z34-5.1.6, etc.

Technical Specifications: