Micro Medical Ntc Thermistor For Incubators And Blood Temperature Monitoring

Brief Instruction:

The item is one miniature medical temperature sensor NTC thermistor. The miniature medical temperature sensors are encapsulated with epoxy in polyimide tubes OD 0.3mm&OD0.6&OD1.0. It takes the enamelled wire OD 0.05*2mm&OD0.12*2&OD0.2*2 as the lead wire.

Features:

Fast thermal response time, for example several seconds

Operating temperature range: 0℃~100℃

High precision, up to 0.1℃

Fast response

Good interchangeability, good stability

Compact size, whether NTC chip or epoxy package size can be very small.

Application:

Ablation temperature monitoring

Blood temperature monitoring

Incubators, patient warming and endovascular cooling sensors

Medical equipment, electronic thermometer, civil air conditioning, central air conditioning, commercial air conditioning, control of car air conditioning, refrigerator, washing machine, water heater, freezing, refrigeration, fire alarm, transport of the temperature of the food system, control of the temperature of greenhouse vegetables, industrial automation control, construction, etc. Temperature transmitter, temperature display instrument, multi point temperature measuring instrument, automobile air conditioning controller, high precision temperature density instrument and equipment.

Structure and Dimensions:(Unit:mm)

Product picture/images:

Standard packing (inner packing): 1 pcs/polybag

Operation Notice

1. Application:Temperature measure ；　

2. The current flowing through the NTC is controlled within the Pmax range to avoid the measurement error caused by the self-heating of the component.

3. Avoid excessive heat shock,The hot air blow should beat least 30mm to the probe in case heat shrink protection tube need to be attached.

4. Storage Temperature -10℃～40℃,≤75%RH；Avoid in a corrosive gas and sunlit environment; After opening the package, it needs to be sealed again.

5. According to the structure of Glass coating NTC thermistor, when end user install, to avoid the epoxy head subjected too much tensile force and bending force from the lead wire,The lead wire shall be controlled at a bending point or a force point on a lead wire 6mm or less below the sealing head.So as not to hurt the chip, resulting in resistance drifting and even open circuit, especially when the component is heated.