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High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules 
High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules 
High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules 
High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules 
Specifications
Brand Name :
ZIITEK
Model Number :
TIF™340
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
1000pcs/bag
Products name :
High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules
Feature :
Soft ane fiberglass reinforced
Thermal conductivity :
3.0W/m-K
Keywords :
Thermal Conductive Pad
Material :
Ceramic filled silicone elastomer
Color :
Gray
Hardness :
27±5 Shore 00
Description

High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules

The TIF™340 is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules 

TIF300 Series Datasheet-(E)-REV02-CRM.pdf

Features:

> Outstanding thermal performance: 3.0W/mK
> Moldability for complex parts
> Soft and Compressible for low stress applications
> RoHS compliant

>Easy release construction

>High durability


Applications

> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes

Typical Properties of TIF™340 Series
Color Gray Visual
Construction &Compostion Ceramic filled silicone ******
Thinkness range 0.020"(0.50mm~0.200"(5.0mm) ASTM D374
Hardness 27±5 Shore 00 ASTM 2240
Specific Gravity 3.05 g/cc ASTM D792
Continuos Use Temp -40-160℃ ******
Dielectric BreakdownVoltage @ 1.0mm,AC(v) ≥5500 ASTM D149
Dielectric Constant @MHz 4.5 ASTM D150
Volume Resistivity(Ohm-cm) ≥1.0X10¹² Ohm-meter ASTM D257
Thermal conductivity 3.0 W/m-K ASTM D5470
Fire rating V-0 UL94

Product Thicknesses:

0.020-inch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes:

8"x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.


Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules 

Packaging Details & Lead time

The packaging of thermal condauctive pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Our services

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Product tags

thermal conductive pads

,

thermal interface material pad

,

polystyrene xps insulation board
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High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules 

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF™340
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
video
High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules 
High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules 

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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