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3W / mK Thermal Gap Filler / Silicone Rubber Gap Pad With Heat Sinking Housing
3W / mK Thermal Gap Filler / Silicone Rubber Gap Pad With Heat Sinking Housing
3W / mK Thermal Gap Filler / Silicone Rubber Gap Pad With Heat Sinking Housing
3W / mK Thermal Gap Filler / Silicone Rubber Gap Pad With Heat Sinking Housing
Specifications
Brand Name :
ZIITEK
Model Number :
TIF160-30-25U
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
10000/day
Delivery Time :
3-5work days
Packaging Details :
1000pcs/bag
Thermal conductivity& Compostion :
3W/m-K
Thickness :
1.25mmT
Color :
pink
branch name :
ZIITEK
Hardness :
27 SHORE00
Description

Best price best quality 3W/mK silicone rubber Thermal gap pad from China manufacturer

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

The TIF160-30-25U is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.


Features:


> Good thermal conductive: 3 W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness


Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Typical Properties of TIF™160-30-25U
Color

PINK

 Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion		 Ceramic filled silicone rubber *** 10mils / 0.254 mm 0.21
20mils / 0.508 mm 0.27
Specific Gravity 2.80 g /cc ASTM D297

30mils / 0.762 mm

 0.39

40mils / 1.016 mm

 0.43
Heat Capacity 1 l /g-K ASTM C351

50mils / 1.270 mm

 0.50

60mils / 1.524 mm

0.58
Hardness 27 Shore 00 ASTM 2240

70mils / 1.778 mm

 0.65

80mils / 2.032 mm

 0.76
Tensile Strength

55 ps

 ASTM D412

90mils / 2.286 mm

 0.85

100mils / 2.540 mm

 0.94
Continuos Use Temp -50 to 200℃

***

110mils / 2.794 mm

 1.00

120mils / 3.048 mm

 1.07
Dielectric Breakdown Voltage >10000 VAC ASTM D149

130mils / 3.302mm

 1.16

140mils / 3.556 mm

 1.25
Dielectric Constant 7.5 MHz ASTM D150

150mils / 3.810 mm

 1.31

160mils / 4.064 mm

 1.38
Volume Resistivity 8X1012Ohm-meter ASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

 1.50
Fire rating 94 V0

equivalent UL

190mils / 4.826 mm

 1.60

200mils / 5.080 mm

 1.72
Thermal conductivity 3 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

Standard Thicknesses:

0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:

8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.
3W / mK Thermal Gap Filler / Silicone Rubber Gap Pad With Heat Sinking Housing

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

FAQ

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Product tags

thermal gap filler pad

,

silicon free thermal gap pad

,

heatsink cooling thermal conductive silicone pad
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3W / mK Thermal Gap Filler / Silicone Rubber Gap Pad With Heat Sinking Housing

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF160-30-25U
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
3W / mK Thermal Gap Filler / Silicone Rubber Gap Pad With Heat Sinking Housing
3W / mK Thermal Gap Filler / Silicone Rubber Gap Pad With Heat Sinking Housing

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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