MachineU > China Products > Consumer Electronic > Computer Hardware & Software > Laptop Cooling Pads
2.0W / mK Thermal Conductivity Silicone Gap Pad TIF150-20-12U For CPU / PCB / LED
2.0W / mK Thermal Conductivity Silicone Gap Pad TIF150-20-12U For CPU / PCB / LED
2.0W / mK Thermal Conductivity Silicone Gap Pad TIF150-20-12U For CPU / PCB / LED
2.0W / mK Thermal Conductivity Silicone Gap Pad TIF150-20-12U For CPU / PCB / LED
Specifications
Brand Name :
ZIITEK
Model Number :
TIF150-20-12U
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
10000/day
Delivery Time :
3-5work days
Packaging Details :
1000pcs/bag
Thermal conductivity& Compostion :
2 W/m-K
Color :
Blue
Continuos Use Temp :
-50 to 200℃
Hardness :
27 Shore 00
Thickness :
1.25mmT
Description

2.0W/mK Thermal Conductivity Silicone Thermal Gap Pad For CPU/PCB/LED

The TIF150-20-12U thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.

Company Profile

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


Features:


> Good thermal conductive: 2.0 W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness


Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Typical Properties of TIF™150-20-12U
Color

Blue

 Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
 *** 10mils / 0.254 mm 0.21
20mils / 0.508 mm 0.27
Specific Gravity
 2.80 g /cc ASTM D297

30mils / 0.762 mm

 0.39

40mils / 1.016 mm

 0.43
Heat Capacity
 1 l /g-K ASTM C351

50mils / 1.270 mm

 0.50

60mils / 1.524 mm

0.58
Hardness
 27 Shore 00 ASTM 2240

70mils / 1.778 mm

 0.65

80mils / 2.032 mm

 0.76
Tensile Strength

55 ps

 ASTM D412

90mils / 2.286 mm

 0.85

100mils / 2.540 mm

 0.94
Continuos Use Temp
 -50 to 200℃

***

110mils / 2.794 mm

 1.00

120mils / 3.048 mm

 1.07
Dielectric Breakdown Voltage
 >10000 VAC ASTM D149

130mils / 3.302mm

 1.16

140mils / 3.556 mm

 1.25
Dielectric Constant
 7.5 MHz ASTM D150

150mils / 3.810 mm

 1.31

160mils / 4.064 mm

 1.38
Volume Resistivity
 8X1012Ohm-meter ASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

 1.50
Fire rating
 94 V0

equivalent UL

190mils / 4.826 mm

 1.60

200mils / 5.080 mm

 1.72
Thermal conductivity
 2 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

Standard Thicknesses:

0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:

8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.
2.0W / mK Thermal Conductivity Silicone Gap Pad TIF150-20-12U For CPU / PCB / LED

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Product tags

heat pad high thermal conductivity

,

fr4 pcb thermal conductivity

,

thermal conductivity of fr4 pcb
Send your message to this supplier
Send Now

2.0W / mK Thermal Conductivity Silicone Gap Pad TIF150-20-12U For CPU / PCB / LED

Ask Latest Price
Product Detail
Brand Name :
ZIITEK
Model Number :
TIF150-20-12U
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
2.0W / mK Thermal Conductivity Silicone Gap Pad TIF150-20-12U For CPU / PCB / LED
2.0W / mK Thermal Conductivity Silicone Gap Pad TIF150-20-12U For CPU / PCB / LED

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
Discover similar products
View More
Watch related videos

Find Similar Products By Category:

Supplier Homepage Products Thermal Gap Filler
MachineU China Products Consumer Electronic Computer Hardware & Software Laptop Cooling Pads
Contact Supplier
Submit Requirement