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3.5mm T Thermal Gap Filler / Thermal Conductive Pad TIF3140 For Cooling Electronic Elements
3.5mm T Thermal Gap Filler / Thermal Conductive Pad TIF3140 For Cooling Electronic Elements
3.5mm T Thermal Gap Filler / Thermal Conductive Pad TIF3140 For Cooling Electronic Elements
3.5mm T Thermal Gap Filler / Thermal Conductive Pad TIF3140 For Cooling Electronic Elements
Specifications
Brand Name :
ziitek
Model Number :
TIF3140
Certification :
UL & RoHs
Place of Origin :
Guangdong, China
MOQ :
1000
Price :
0.2USD/PCS to 12USD/PCS
Supply Ability :
100000PCS/month
Delivery Time :
3-5 work days
Packaging Details :
20*20*15
color :
grey
material :
silicone elastomer
thickness :
3.5mmT
Hardness :
27 Shore 00
Description

soft thermal pad 27shore00 3.5mmT thermal gap filler pad TIF3140 2.8W conductivity for cooling electronic elements

The TIF3140 Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. ZiitekTIF3140 is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

TIF300 Series Datasheet-(E)-REV02-CRM.pdf


Features


>Good thermal conductive: 2.8 W/mK
>Naturally tacky needing no further adhesive coating
>Soft and Compressible for low stress applications
>Available in varies thickness

Applications

>Cooling components to the chassis of frame
>High speed mass storage drives
>Heat Sinking Housing at LED-lit BLU in LCD
>LED TV and LED-lit lamps
>RDRAM memory modules
>Micro heat pipe thermal solutions
>Automotive engine control units
>Telecommunication hardware
>Handheld portable electronics
>Semiconductor automated test equipment

Typical Properties of TIF3140 Series
Color
 Gray Visual Composite Thickness hermal Impedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
 *** 10mils / 0.254 mm 0.42
20mils / 0.508 mm 0.49
Specific Gravity
 3.05 g/cc ASTM D297 30mils / 0.762 mm 0.59
40mils / 1.016 mm 0.66
Heat Capacity
 1 l/g-K ASTM C351 50mils / 1.270 mm 0.77
60mils / 1.524 mm 0.81
Hardness
 27 Shore 00 ASTM 2240 70mils / 1.778 mm 0.89
80mils / 2.032 mm 0.97
Tensile Strength 35 psi ASTM D412 90mils / 2.286 mm 1.06
100mils / 2.540 mm 1.14
Continuos Use Temp
 -40 to 160℃ *** 110mils / 2.794 mm 1.22
120mils / 3.048 mm 1.33
Outgassing(TML)
 0.45% ASTM E595 130mils / 3.302mm 1.40
140mils / 3.556 mm 1.48
Dielectric Constant
 6.5 MHz ASTM D150 150mils / 3.810 mm 1.59
160mils / 4.064 mm 1.67
Volume Resistivity
 4.2X1013
Ohm-meter		 ASTM D257 170mils / 4.318 mm 1.76
180mils / 4.572 mm 1.85
Fire rating
 94 V0 equivalent UL 190mils / 4.826 mm 1.90
200mils / 5.080 mm 1.99
Thermal conductivity
 2.8 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

Standard Thicknesses:
0.140" (3.56mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

3.5mm T Thermal Gap Filler / Thermal Conductive Pad TIF3140 For Cooling Electronic Elements

Quality:
Do it Right the First Time, Total Quality Control.

Effectiveness:
Work Precisely and Thoroughly for Effectiveness.

Service:
Quick Response, On Time Delivery and Excellent Service.

TeamWord:
Teamwork that Integrates Sales, Marketing, Engineering, R&D, Manufacturing, Logistics, all other Supporting and Services to Satisfy Customer Needs.

FAQ
Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

Product tags

heatsink cooling thermal conductive silicone pad

,

thermal conductive pad 2mm

,

heatsink thermal pad
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3.5mm T Thermal Gap Filler / Thermal Conductive Pad TIF3140 For Cooling Electronic Elements

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Product Detail
Brand Name :
ziitek
Model Number :
TIF3140
Certification :
UL & RoHs
Place of Origin :
Guangdong, China
MOQ :
1000
Price :
0.2USD/PCS to 12USD/PCS
Contact Supplier
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3.5mm T Thermal Gap Filler / Thermal Conductive Pad TIF3140 For Cooling Electronic Elements
3.5mm T Thermal Gap Filler / Thermal Conductive Pad TIF3140 For Cooling Electronic Elements

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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