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Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer
Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer
Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer
Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer
Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer
Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer
Specifications
Brand Name :
ZIITEK
Model Number :
TIF860HP
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
10000/day
Delivery Time :
3-5work days
Packaging Details :
1000pcs/bag
Thermal conductivity& Compostion :
12 W/m-K
Density（g/cm3） :
3.55
Dielectric Constant :
4.5 MHz
Color :
gray
Continuos Use Temp :
-40 to 160℃
Thickness :
1.25mmT
applications :
electronics
usage :
heat transfer
Description

Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer

The TIF860HP

use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Features:

Available in varies thicknesses 12 W/mK
Broad range of hardnesses available
Moldability for complex parts
Outstanding thermal performance
High tack surface reduces contact resistance


Applications:

Memory Modules
Mass storage devices
Automotive electronics
Set top boxes
Audio and video components
IT infrastructure
GPS navigation and other portable devices
CD-Rom, DVD-Rom cooling
LED Power Supply

Typical Properties of TIF860HP
Color

gray

 Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
 *** 10mils / 0.254 mm 0.21
20mils / 0.508 mm 0.27
Hardness(Shore00 Thickness ≥0.75mm)

40

 ASTM D297

30mils / 0.762 mm

 0.39

40mils / 1.016 mm

 0.43
Hardness(Shore00 Thickness ＜0.75mm)

65

 ASTM C351

50mils / 1.270 mm

 0.50

60mils / 1.524 mm

0.58
Density(g/cm3) 3.55 ASTM 2240

70mils / 1.778 mm

 0.65

80mils / 2.032 mm

 0.76
Thickness range

0.030''~0.200''

 ASTM D412

90mils / 2.286 mm

 0.85

100mils / 2.540 mm

 0.94
Continuos Use Temp
 -40 to 160℃

***

110mils / 2.794 mm

 1.00

120mils / 3.048 mm

 1.07
Dielectric Breakdown Voltage
 ≥5500 VAC ASTM D149

130mils / 3.302mm

 1.16

140mils / 3.556 mm

 1.25
Dielectric Constant
 4.5 MHz ASTM D150

150mils / 3.810 mm

 1.31

160mils / 4.064 mm

 1.38
Volume Resistivity
 1.0X1012
Ohm-meter		 ASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

 1.50
Fire rating
 94 V-0

equivalent UL

190mils / 4.826 mm

 1.60

200mils / 5.080 mm

 1.72
Thermal conductivity
 12 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

Standard Sheets Sizes:

8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.
Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer
6.Quality assurance contract

Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Product tags

heatsink cooling thermal conductive silicone pad

,

thermal conductive pads

,

heat pad high thermal conductivity
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Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF860HP
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
video
Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer
Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer
Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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