MachineU > China Products > Minerals & Metallurgy > Non-ferrous Metal > Ingots > Silicon Ingots
Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness
Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness
Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness
Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness
Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness
Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness
Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness
Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness
Specifications
Brand Name :
ZIITEK
Model Number :
TIF100-02S
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
10000/day
Delivery Time :
3-5work days
Packaging Details :
1000pcs/bag
hermalImpedance :
0.82@10psi(℃-in²/W)
Specific Gravity :
2.1 g/cc
Thermal conductivity :
1.5W/m-K
Color :
Gray
Continuos Use Temp :
-50 to 200℃
Hardness :
45 Shore 00
Description

Semiconductor automated test equipment (ATE) Ziitek Thermal Gap Filler in MB application TIF100-02S


The TIF100-02S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Typical Properties of TIF™100-02S Series
Color

Gray

VisualComposite ThicknesshermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***10mils / 0.254 mm0.21
20mils / 0.508 mm0.27
Specific Gravity
2.1 g/ccASTM D297

30mils / 0.762 mm

0.39

40mils / 1.016 mm

0.43
Heat Capacity
1 l /g-KASTM C351

50mils / 1.270 mm

0.50

60mils / 1.524 mm

0.58

Hardness
45 Shore 00ASTM 2240

70mils / 1.778 mm

0.65

80mils / 2.032 mm

0.76
Tensile Strength

55 ps

ASTM D412

90mils / 2.286 mm

0.85

100mils / 2.540 mm

0.94
Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.00

120mils / 3.048 mm

1.07
Dielectric Breakdown Voltage
>10000 VACASTM D149

130mils / 3.302mm

1.16

140mils / 3.556 mm

1.25
Dielectric Constant
7.5 MHzASTM D150

150mils / 3.810 mm

1.31

160mils / 4.064 mm

1.38
Volume Resistivity
8X1012Ohm-meterASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

1.50
Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

1.60

200mils / 5.080 mm

1.72
Thermal conductivity
1.5W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470

Features:
> Good thermal conductive:1.5 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Standard Thicknesses:
0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:

8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.
Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract


Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

TIF100-02S Datasheet-REV02.pdf





































Product tags

pdc polycrystalline diamond compact

,

silicon nitride wafer

,

what is low modulus silicone
Send your message to this supplier
Send Now

Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness

Ask Latest Price
Watch Video
Product Detail
Brand Name :
ZIITEK
Model Number :
TIF100-02S
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
video
Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness
Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness
Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness
Soft Compressible siliocne gray Thermally Gap Filler TIF100-02S For RDRAM Memory Modules 1.5W/m-K,45 shore00 hardness

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products Thermal Gap Filler
MachineU China Products Minerals & Metallurgy Non-ferrous Metal Ingots Silicon Ingots
Contact Supplier
Submit Requirement