Specifications
Brand Name :
Ziitek
Model Number :
TIA820FG
Certification :
RoHs
Place of Origin :
China
MOQ :
10SQM
Supply Ability :
1000SQM/Day
Delivery Time :
2-3Work day
Packaging Details :
10RL/bag
The thickness of the :
0.020" 0.508mm
The breakdown voltage :
> 3500 Vac
Thickness tolerance :
±0.002" ±0.05mm
Peel Adhesion :
1200 g/inch2
Thermal Conductivity :
0.8 W/mK
Thermal impedance @ 50 psi :
1.43℃-in²/W
Description

Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive

The TIA™820FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.

TIA800FG Series Datasheet-(E)-REV01.pdf


Features


> Thermal Conductivity: 0.8 W/mK
> High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive

Applications


> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive
> Can be used instead of heat cure adhesive,screw mounting or clip mounting

Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive

Typical Properties of TIA™800FG Series
Product Name TIATM805FG TIATM806FG TIATM808FG TIATM810FG TIATM815FG TIATM820FG Test Method
Color White Visual
Adhesive Type Acrylic Adhesive ********
Backing Type Glass fiber ********

Composite

Thickness

0.005" 0.127mm 0.006" 0.152mm 0.020" 0.203mm 0.010" 0.254mm 0.015" 0.381mm 0.020" 0.508mm ASTM D374

Aluminum

Foil Thickness

±0.001" ±0.025mm ±0.001" ±0.025mm ±0.0012" ±0.03mm ±0.0012" ±0.03mm ±0.0015" ±0.038mm ±0.002" ±0.05mm

ASTM D374

Voltage Breakdown > 2000 Vac > 2000 Vac > 2300 Vac > 3000 Vac > 3500 Vac > 3500 Vac ASTM D149
Peel Adhesion 1200 g/inch2 JIS K02378

Holding Power

25℃/Days

> 120 kg/inch2 JIS K023711
Holding Power 120℃/Hours > 10 kg/inch2 JIS K023711

Recommend

Using Pressure

10 psi ********
Thermal Conductivity 0.8 W/mK ********

Thermal

Impedance

@50psi

0.52℃-in²/W 0.59℃-in²/W 0.83℃-in²/W 0.91℃-in²/W 1.15℃-in²/W 1.43℃-in²/W ASTM D5470

Standard Thicknesses:
0.005"(0.127mm) 0.006"(0.152mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.015"(0.381mm) 0.020"(0.508mm)
Consult the factory alternate thickness.

Standard Sizes:
10" x 18"(254mm x 457mm) 10" x 400'(254mm x 121.9M)
Individual die cut shapes can be supplied.

Reinforcement:
TIA™800 Series sheets are fiberglass reinforced.
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Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive

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Brand Name :
Ziitek
Model Number :
TIA820FG
Certification :
RoHs
Place of Origin :
China
MOQ :
10SQM
Supply Ability :
1000SQM/Day
Contact Supplier
video
Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive
Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive
Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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