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0.8 W/MK Glass Fiber Acrylic Thermal Adhesive Tape For Bonding Heat Dissipation Fins
0.8 W/MK Glass Fiber Acrylic Thermal Adhesive Tape For Bonding Heat Dissipation Fins
0.8 W/MK Glass Fiber Acrylic Thermal Adhesive Tape For Bonding Heat Dissipation Fins
0.8 W/MK Glass Fiber Acrylic Thermal Adhesive Tape For Bonding Heat Dissipation Fins
0.8 W/MK Glass Fiber Acrylic Thermal Adhesive Tape For Bonding Heat Dissipation Fins
0.8 W/MK Glass Fiber Acrylic Thermal Adhesive Tape For Bonding Heat Dissipation Fins
0.8 W/MK Glass Fiber Acrylic Thermal Adhesive Tape For Bonding Heat Dissipation Fins
0.8 W/MK Glass Fiber Acrylic Thermal Adhesive Tape For Bonding Heat Dissipation Fins
Specifications
Brand Name :
Ziitek
Model Number :
TIA808FG
Certification :
RoHs
Place of Origin :
China
MOQ :
10SQM
Supply Ability :
1000SQM/Day
Delivery Time :
2-3Work day
Packaging Details :
10RL/bag
Thickness :
0.1mmT~0.5mmT
Adhesive Type :
Acrylic Adhesive
Backing Type :
Glass fiber
Peel Adhesion :
1200 g/inch2
Thermal Conductivity :
1.0 W/mK
Voltage Breakdown :
> 3000 Vac
Description

High performance thermally conductive acrylic adhesive tape For LED Mount Heat Sink

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.


Features


> Thermal Conductivity: 0.8 W/mK
> High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive

Applications


> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive
> Can be used instead of heat cure adhesive,screw mounting or clip mounting

Typical Properties of TIA™800FG Series
Product Name TIATM805FG TIATM806FG TIATM808FG TIATM810FG TIATM815FG TIATM820FG Test Method
Color White Visual
Adhesive Type Acrylic Adhesive ********
Backing Type Glass fiber ********

Composite

Thickness

 0.005" 0.127mm 0.006" 0.152mm 0.020" 0.203mm 0.010" 0.254mm 0.015" 0.381mm 0.020" 0.508mm ASTM D374

Aluminum

Foil Thickness

 ±0.001" ±0.025mm ±0.001" ±0.025mm ±0.0012" ±0.03mm ±0.0012" ±0.03mm ±0.0015" ±0.038mm ±0.002" ±0.05mm

ASTM D374
Voltage Breakdown > 2000 Vac > 2000 Vac > 2300 Vac > 3000 Vac > 3500 Vac > 3500 Vac ASTM D149
Peel Adhesion 1200 g/inch2 JIS K02378

Holding Power

25℃/Days

 > 120 kg/inch2 JIS K023711
Holding Power 120℃/Hours > 10 kg/inch2 JIS K023711

Recommend

Using Pressure

 10 psi ********
Thermal Conductivity 0.8 W/mK ********

Thermal

Impedance

@50psi

 0.52℃-in²/W 0.59℃-in²/W 0.83℃-in²/W 0.91℃-in²/W 1.15℃-in²/W 1.43℃-in²/W ASTM D5470
Standard Thicknesses:

0.005"(0.127mm) 0.006"(0.152mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.015"(0.381mm) 0.020"(0.508mm)
Consult the factory alternate thickness.

Standard Sizes:

10" x 18"(254mm x 457mm) 10" x 400'(254mm x 121.9M)
Individual die cut shapes can be supplied.

Reinforcement:

TIA™800 Series sheets are fiberglass reinforced.
0.8 W/MK Glass Fiber Acrylic Thermal Adhesive Tape For Bonding Heat Dissipation Fins

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Product tags

heatsink adhesive

,

thermally conductive silicone adhesive

,

heatsink glue adhesive
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0.8 W/MK Glass Fiber Acrylic Thermal Adhesive Tape For Bonding Heat Dissipation Fins

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Product Detail
Brand Name :
Ziitek
Model Number :
TIA808FG
Certification :
RoHs
Place of Origin :
China
MOQ :
10SQM
Supply Ability :
1000SQM/Day
Contact Supplier
video
0.8 W/MK Glass Fiber Acrylic Thermal Adhesive Tape For Bonding Heat Dissipation Fins
0.8 W/MK Glass Fiber Acrylic Thermal Adhesive Tape For Bonding Heat Dissipation Fins
0.8 W/MK Glass Fiber Acrylic Thermal Adhesive Tape For Bonding Heat Dissipation Fins
0.8 W/MK Glass Fiber Acrylic Thermal Adhesive Tape For Bonding Heat Dissipation Fins

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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