High Performance Conductive AcrylicTIA 820 Series 0.9 W/mK Thermal Adhesive Tape with double-sided adhesive
The TIA™820 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
Features
> Thermal Conductivity: 0.9 W/mK
> High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive
Applications
Mount heat sink onto BGA graphic processor or drive processor. |
Mount heat spreader onto power converter PCB or onto motor control PCB |
Can be used instead of heat cure adhesive,screw mounting or clip mounting |
Heat sink onto BGA graphic processor |
Heat sink to computer processor |
Heat sink onto drive processor |
LED Power Supply |
LED Controller |
LED Lights |
LED Ceilinglamp |
Monitoring the Power Box |
AD-DC Power Adapters |
Rainproof LED Power Supply |
Waterproof LED Power Supply |
Piranha wroof and common lED module |
LED module for Channelletters |
SMD LED module |
LED Flesible strip, LED bar |
Typical Properties of TIA™800 Series | |||||||
Product Name | TIATM805 | TIATM806 | TIATM808 | TIATM810 | TIATM815 | TIATM820 | Test Method |
Color | White | Visual | |||||
Adhesive Type | Acrylic Adhesive | ******** | |||||
Backing Type | N/A | ******** | |||||
Composite Thickness | 0.005" 0.127mm | 0.006" 0.152mm | 0.020" 0.203mm | 0.010" 0.254mm | 0.015" 0.381mm | 0.020" 0.508mm | ASTM D374 |
Aluminum Foil Thickness | ±0.001" ±0.025mm | ±0.001" ±0.025mm | ±0.0012" ±0.03mm | ±0.0012" ±0.03mm | ±0.0015" ±0.038mm | ±0.002" ±0.05mm | ASTM D374 |
Voltage Breakdown | > 600Vac | > 1200 Vac | > 1800 Vac | > 2500 Vac | > 2700 Vac | > 3500 Vac | ASTM D149 |
Peel Adhesion | 1200 g/inch2 | JIS K02378 | |||||
Holding Power 25℃/Days | > 120 kg/inch2 | JIS K023711 | |||||
Holding Power 120℃/Hours | > 10 kg/inch2 | JIS K023711 | |||||
Recommend Using Pressure | 10 psi | ******** | |||||
Thermal Conductivity | 0.9 W/mK | ******** | |||||
Thermal Impedance@50psi | 0.45℃-in²/W | 0.51℃-in²/W | 0.72℃-in²/W | 0.81℃-in²/W | 0.92℃-in²/W | 1.02℃-in²/W | ASTM D5470 |