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PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors
PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors
PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors
PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors
Specifications
Brand Name :
Ziitek
Model Number :
TIA608P
Certification :
RoHs
Place of Origin :
China
MOQ :
10SQM
Supply Ability :
1000SQM/Day
Delivery Time :
2-3Work day
Packaging Details :
10RL/bag
Color :
White
Backing type :
PET
Continuous Use Temp :
-45 °C to 120 °C
Thickness :
0.2 mm
Voltage Breakdown :
> 1200 Vac
Holding Power (80 °C/Hours) :
> 48 Hours
Description

Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors

The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.


Features


>Thermal Conductivity: 0.8 W/mK
>High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
>High performance, thermally conductive acrylic adhesive
>Fire rating equate 94 V0


Applications


>Mount heat sink onto BGA graphic processor or drive processor
>Mount heat spreader onto power converter PCB or onto motor control PCB
>High performance, thermally conductive acrylic adhesive
>Can be used instead of heat cure adhesive,screw mounting or clip mounting

Typical Properties of TIA608P Series
Typical Properties TIA608P test
Color White view
Adhesive Type Acrylic Adhesive **********
Backing Type PET **********

Continuous

Use Temp

 -45 °C to 120 °C **********
Thickness 0.008" 0.203mm ASTM D374
Voltage Breakdown > 1200 Vac ASTM D149
Thermal Conductivity 0.8 W/mK ASTM D5470
180°Peel Adhesion > 1200 g/inch (Steel, Immediate) PSTC-1
180°Peel Adhesion > 1400 g/inch (Steel after 24 hrs) PSTC-1
Holding Power (25 °C/Hours) > 48 Hours PSTC-7
Holding Power (80 °C/Hours) > 48 Hours PSTC-7
Fire rating equate 94 V0 *****

Standard Thicknesses:

0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)

Consult the factory alternate thickness.

Standard Sizes:

40" x 100'(1016mm x 30.48M) Individual die cut shapes can be supplied.

Reinforcement:

TIA™600P series The coil can be filled with PET.

PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors
Product tags

high thermal conductivity adhesive

,

pcb heat conducting adhesive

,

thermally conductive adhesive transfer tape
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PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors

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Product Detail
Brand Name :
Ziitek
Model Number :
TIA608P
Certification :
RoHs
Place of Origin :
China
MOQ :
10SQM
Supply Ability :
1000SQM/Day
Contact Supplier
video
PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors
PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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