4.0W Insulation Silicone Thermal Conductive Sheet Silicone Thermal Transfer Pad For Battery CPU
The TIF100-40-10S is an extremely soft gap filling material rated at a thermal conductivity of 4.0W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. ZiitekTIF100-40-10S is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.
Features:
> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
Typical Properties of TIF100-40-10S Series | ||
Color | Gray | Visual |
Construction &Compostion | Ceramic filled silicone elastomer | ****** |
Thickness range | 0.020"(0.5mm)~0.200“(5.0mm) | ****** |
Specific Gravity | 3.2 g/cc | ASTM D297 |
Hardness | 45 Shore 00 | ASTM 2240 |
Continuos Use Temp | -45 to 200℃ | *** |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
Dielectric Constant | 4.5 MHz | ASTM D150 |
Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 |
Flame rating | 94 V0 | equivalent UL |
Thermal conductivity | 4.0W/m-K | ASTM D5470 |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.