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Factory Thermal Conductive Gel For Electronic Components Cooling
Factory Thermal Conductive Gel For Electronic Components Cooling
Specifications
Brand Name :
ZIITEK
Model Number :
TIF015-07
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
10000/day
Delivery Time :
7-15work days
Packaging Details :
1000tubes
Products Name :
Factory Thermal Conductive Gel For Electronic Components Cooling
Specific Gravity :
2.5 g/cc
Good thermal conductive :
1.5 W/mK
Color :
Green
Continuous Use Temperature :
-45~200℃
Flame Rating :
94V0
Keywords :
Thermal Conductive Gel
Material :
Ceramic filled silicon material
Description

Factory Thermal Conductive Gel For Electronic Components Cooling

TIF015-07 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF015-07 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

TIF015-07 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF015-07 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .

TIF015-07-Specification-sheet.-pdf.pdf

Factory Thermal Conductive Gel For Electronic Components Cooling

Application

> Heat-sink & frame

> LED backlight module,LED lighting

> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications

Feature

> Thermal conductivity: 1.5W/mK

> Soft, very low compression

> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling

TIFTM015-07 Property
Property Value Test method
Color Green Visual
Construction & Composition Ceramic filled silicon material *****
Viscosity 4000 Pa.s GB/T 10247
Specific Gravity 2.5g/cm³ ASTM D297
Thermal conductivity 1.5 W/mK ISO 22007-2
Thermal diffusivity 0.847 mm²/s ISO 22007-2
Specific heat capacity 2.2 MJ/m3K ISO 22007-2
Continuous Use Temperature -45 ~200°C ******
Flame Rating 94V0 UL E331100

Package :

30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.


Factory Thermal Conductive Gel For Electronic Components Cooling

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Factory Thermal Conductive Gel For Electronic Components Cooling

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Product tags

cooling gel

,

thermal gel

,

thermal conductive gel
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Factory Thermal Conductive Gel For Electronic Components Cooling

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF015-07
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
Factory Thermal Conductive Gel For Electronic Components Cooling

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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