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Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module
Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module
Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module
Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module
Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module
Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module
Specifications
Brand Name :
ZIITEK
Model Number :
TIF050-11
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000tube
Price :
negotiation
Supply Ability :
10000/day
Delivery Time :
7-15work days
Packaging Details :
600cc/tube
Specific Gravity :
3.05g/cc
thermal diffusivity :
1.695mm2/s
Fire rating :
94-V0
Color :
grey
Outgassing(TML) :
0.6%
Good thermal conductive :
5 W/mK
Description

Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module

TIF050-11 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF050-11 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

TIF050-11 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF050-11 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .

TIF050-11 Series Datasheet-REV02.pdf

Application

>Heat-sink & frame

>LED backlight module,LED lighting

>High speed hardware driver

>Micro heat pipe ,Vihicel enginee controler

>Telecom industry

> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics

Feature

>Thermal conductivity: 5W/mK

>Soft, very low compression

>Operate automaticly

>Soft and Compressible for low stress applications

TIFTM050-11 Property
Color Gray Visual
Construction & Composition Ceramic filled silicon material **********
Viscosity 2000,000cps GB/T 10247
Specific Gravity 3.05 g/cc ASTM D297
Thermal conductivity 5.0 W/mK ISO 22007-2
Thermal diffusivity 1.695 mm2/s ISO 22007-2
Specific heat capacity 2.3 MJ/m3K ISO 22007-2
Continuous Use Temperature -45 ~200°C ******
Dielectric breakdown strength 200 V/mil ASTM D149
Flame Rating 94V0 E331100
Outgassing,%TML 0.60% ASTM E595

Package :

•30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.

Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module

Product tags

led backlight membrane overlay

,

led heatsink diy

,

diy heatsink for led
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Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF050-11
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000tube
Price :
negotiation
Contact Supplier
Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module
Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module
Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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