TIF020-19 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF020-19 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

TIF020-19 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF020-19 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .

Application

>Heat-sink & frame

>LED backlight module,LED lighting

>High speed hardware driver

>Micro heat pipe ,Vihicel enginee controler

>Telecom industry

>wireless routers

>Chipset

> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics

Feature

>Thermal conductivity: 2.0W/mK

>Soft, very low compression

>Operate automaticly

Package :

30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.