Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials
The TIC™808A is low melting point thermal interface material. At 50℃, The TIC™800A Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800A Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™808A shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
TIC800A Series Datasheet-(E)-REV01.pdf
Features:
> 0.018℃-in² /W thermal resistanceTIC800A Series Datasheet-(E)-REV01.pdf
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Applications:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
Typical Properties of TIC™808A Series | |||||
Product Name | TICTM808A | Testing standards | |||
Color | Ashy | Visual | |||
Composite Thickness | 0.008" (0.203mm) | | |||
Thickness Tolerance | ±0.0008" (±0.019mm) | | |||
Density | 2.5g/cc | Helium Pycnometer | |||
Work Temperature | -25℃~125℃ | | |||
phase transition temperature | 50℃~60℃ | | |||
Thermal conductivity | 2.5 W/mK | ASTM D5470 (modified) | |||
Thermal lmpedance @ 50 psi(345 KPa)@ 50 psi(345 KPa) | 0.047℃-in²/W | ASTM D5470(modified) | |||
0.30℃-cm²/W |
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.Ziitek provide thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products and so on, for various applications.