LED lighting Thermal phase changing materials Interface Pad Pink Low Resistance 0.95 W/MK
The TIC™810P Series is low melting point thermal interface material. At 50℃, The TIC™810P Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™810P Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™810P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
Features:
> 0.024℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Applications:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
Typical Properties of TIC™800P Series | |||||
Product Name | TICTM810P | Testing standards | |||
Color | Pink | Visual | |||
Composite Thickness | 0.010" (0.254mm) | | |||
Thickness Tolerance | ±0.0012" (±0.030mm) | | |||
Density | 2.2g/cc | Helium Pycnometer | |||
Work temperature | -25℃~125℃ | | |||
phase transition temperature | 50℃~60℃ | | |||
Thermal conductivity | 0.95 W/mK | ASTM D5470 (modified) | |||
Thermal lmpedance @ 50 psi(345 KPa) | 0.080℃-in²/W | ASTM D5470 (modified) | |||
0.52℃-cm²/W |
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