MachineU > China Products > Packaging & Printing > Packaging Auxiliary Materials > Adhesive tape
1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured
1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured
1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured
1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured
Specifications
Brand Name :
ziitek
Model Number :
TIS580-12
Certification :
RoHs
Place of Origin :
China
MOQ :
25PC
Supply Ability :
1000PC/Day
Delivery Time :
2-3 work days
Packaging Details :
300ml/1PC
Products name :
1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured
Appearance :
White paste
Density（g/cm3，25℃） :
1.2
Operation temperature（℃） :
-60～250
Thermal Conductivity :
1.2 W/(m·K)
Application :
highpower LED and internal storage module etc
Hardness :
25 Shore 00
Description

1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured

TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective. TIS™580-12 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use. TIS™580-12 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.

TIS580-12 Series Datasheet-(E)-REV01.pdf

1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured

Feature


Good thermal conductivity: 1.2W/mK
Good maneuverability and good adhesion
Low shrinkage
Low viscosity, leads to void-free surface
Good solvent resistance, water resistance
Longer working life
Excellent thermal shock resistance

Application
It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-13, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective.E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers
1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured
Typical values of TISTM580-12
Appearance White paste Test Method
Density(g/cm3,25℃) 1.3 ASTM D297
Tack-free time(min,25℃) ≤20 *****
Cure type(1-component) Dealcoholized *****
Viscosity@25℃ Brookfield (Uncured) 20K cps ASTM D1084
Total cure time(d, 25℃) 3-7 *****
Elongation(%) ≥150 ASTM D412
Hardness(Shore A) 25 ASTM D2240
Lap Shear Strength(MPa) ≥2.0 ASTM D1876
Peel Strength(N/mm) ＞3.5 ASTM D1876
Operation temperature(℃) -60～250 *****
Volume Resistivity(Ω·cm) 2.0×1016 ASTM D257
Dielectric Strength(KV/mm) 21 ASTM D149
Dielectric Constant (1.2MHz) 2.9 ASTM D150
Thermal Conductivity W/(m·K) 1.2 ASTM D5470
Flame Retardancy UL94 V-0

E331100


Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Product tags

thermally conductive silicone adhesive

,

conductive silicone adhesive

,

high thermal conductivity adhesive
Send your message to this supplier
Send Now

1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured

Ask Latest Price
Product Detail
Brand Name :
ziitek
Model Number :
TIS580-12
Certification :
RoHs
Place of Origin :
China
MOQ :
25PC
Supply Ability :
1000PC/Day
Contact Supplier
1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured
1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
Discover similar products
View More
Watch related videos

Find Similar Products By Category:

Supplier Homepage Products Thermal Conductive Adhesive
MachineU China Products Packaging & Printing Packaging Auxiliary Materials Adhesive tape
Contact Supplier
Submit Requirement