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2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200℃
2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200℃
2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200℃
2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200℃
2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200℃
2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200℃
2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200℃
2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200℃
Specifications
Brand Name :
ZIITEK
Model Number :
TIF™100-25-11U
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
1000pcs/bag
Heat Capacity :
1 l/g-K
Thermal conductivity :
2.5 W/m-K
Hardness :
25 Shore 00
Specific Gravity :
2.35 g/cc
Continuos Use Temp :
-50 to 200℃
Outgassing(TML) :
0.55%
Description

2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200℃

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.

Our vast experience allows us to assist our customers best in thermal engineering field.

We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

The TIF™100-25-11U Series is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling Ziitek The TIF™100-25-11U Series maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. Ziitek he TIF™100-25-11U Series features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.Options and ConfigurationsStandard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made configurations available upon request


Features

Good thermal conductive
Moldability for complex parts
Soft and compressible for low stress applications
High tack surface reduces contact resistance
RoHS compliant
UL recognized

Applications

Memory Modules
Mass storage devices
Automotive electronics
Set top boxes
Audio and video components
IT infrastructure
GPS navigation and other portable devices
CD-Rom, DVD-Rom cooling
LED Power Supply

Typical Properties of TIF™TIF™100-25-11U Series
Color
Gray/White
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20
Specific Gravity
2.35 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Heat Capacity
1 l/g-K
ASTM C351
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
25 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgassing(TML)
0.55%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-50 to 200℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5000 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
5.5 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
4.0X1013
Ohm-meter
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
2.5W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470
2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200℃

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

16" x 18"(406mm x 457mm)

TIF™ series Individual die cut shapes can be supplied.

Product tags

heat pad high thermal conductivity

,

thermal conductive pad 2mm

,

heatsink thermal pad
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2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200℃

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF™100-25-11U
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
video
2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200℃
2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200℃
2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200℃
2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200℃

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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