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Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc
Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc
Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc
Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc
Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc
Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc
Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc
Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc
Specifications
Brand Name :
ZIITEK
Model Number :
TIF™500S Series
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
1000pcs/bag
Construction & Compostion :
Ceramic filled silicone rubber
Thermal conductivity :
3.0W/m-K
Hardness :
40 Shore 00
Specific Gravity :
2.64 g/cc
Continuos Use Temp :
-50 to 200℃
Dielectric Breakdown Voltage :
>10000 VAC
Description

Compressible CPU Thermal Pad for High Speed Mass Storage Drives Blue 5.5 MHz Dielectric Constant

The TIF™500S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc

Features

> Good thermal conductive: 3.0 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
Typical Properties of TIF™500S Series
Color

Blue

 Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
 *** 10mils / 0.254 mm 0.36
20mils / 0.508 mm 0.41
Specific Gravity
 2.64 g/cc ASTM D297

30mils / 0.762 mm

 0.47

40mils / 1.016 mm

 0.52
Heat Capacity
 1 l /g-K ASTM C351

50mils / 1.270 mm

0.58

60mils / 1.524 mm

0.65
Hardness
 40 Shore 00 ASTM 2240

70mils / 1.778 mm

 0.72

80mils / 2.032 mm

 0.79
Tensile Strength

45 psi

 ASTM D412

90mils / 2.286 mm

0.87

100mils / 2.540 mm

 0.94
Continuos Use Temp
 -50 to 200℃

***

110mils / 2.794 mm

 1.01

120mils / 3.048 mm

 1.09
Dielectric Breakdown Voltage
 >10000 VAC ASTM D149

130mils / 3.302mm

 1.17

140mils / 3.556 mm

 1.24
Dielectric Constant
 5.5 MHz ASTM D150

150mils / 3.810 mm

 1.34

160mils / 4.064 mm

 1.42
Volume Resistivity
 7.8X10" Ohm-meter ASTM D257

170mils / 4.318 mm

1.50

180mils / 4.572 mm

 1.60
Fire rating
 94 V0

equivalent UL

190mils / 4.826 mm

 1.68

200mils / 5.080 mm

 1.77
Thermal conductivity
 3.0 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

Standard Thicknesses:

0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.

Request adhesive on double side with "A2" suffix.

Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.

Advantage

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

Product tags

high density thermoelectric module

,

3m thermal pad

,

thermoelectric chip
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Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF™500S Series
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
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Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc
Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc
Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc
Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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