Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W
The TIC™803Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™803Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
Features:
No heat sink preheating required |
Low thermal resistance |
Ease of use for high volume manufacturing |
High thixotropic index |
Dry to the touch for pre-apply applications |
High thermal reliability, minimal pump out |
Re-flow compatible |
Cost Effective |
Used where electrical isolation is not required |
Low volatility – less than 1% |
Easy to handle in the manufacturing environment |
Flows but doesn’t run like grease |
Available in custom die-cut shapes, kiss-cut on rolls |
Applications:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
> Telecommunication
Typical Properties of TIC™800Y Series | |||||
Product Name | TICTM803Y | TICTM805Y | TICTM808Y | TICTM810Y | Testing standards |
Color | Yellow | Yellow | Yellow | Yellow | Visual |
Composite Thickness
| 0.003" (0.076mm) | 0.005" (0.126mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | |
Thickness Tolerance | ±0.0006" (±0.016mm) | ±0.0008" (±0.019mm) | ±0.0008" (±0.019mm) | ±0.0012" (±0.030mm) | |
Density | 2.2g/cc | Helium Pycnometer | |||
Work temperature | -25℃~125℃ | ||||
phase transition temperature | 50℃~60℃ | ||||
Thermal conductivity | 0.95 W/mK | ASTM D5470 (modified) | |||
Thermal lmpedance @ 50 psi(345 KPa) | 0.021℃-in²/W | 0.024℃-in²/W | 0.053℃-in²/W | 0.080℃-in²/W | ASTM D5470 (modified) |
0.14℃-cm²/W | 0.15℃-cm²/W | 0.34℃-cm²/W | 0.52℃-cm²/W |