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Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz
Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz
Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz
Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz
Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz
Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz
Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz
Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz
Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz
Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz
Specifications
Brand Name :
ZIITEK
Model Number :
TIF160-40-10S
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
10000/day
Delivery Time :
3-5work days
Packaging Details :
1000pcs/bag
Thermal conductivity :
4.0W/m-K
Volume Resistivity :
4.0X10" Ohm-meter
Tensile Strength :
40 psi
Color :
Gray
Dielectric Constant :
5.5 MHz
Description

Handheld Portable Electronics Thermal Gap Filler with Adhesive Ceramic Filled Silicone Rubber


The TIF160-40-10S is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features:
> Good thermal conductive: 4.0 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Typical Properties of TIF160-40-10S​ Series
Color

Grey

VisualComposite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***10mils / 0.254 mm

0.55

20mils / 0.508 mm

0.82

Specific Gravity

2.10 g/cc

ASTM D297

30mils / 0.762 mm

1.01

40mils / 1.016 mm

1.11

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

1.27

60mils / 1.524 mm

1.45

Hardness
45
(Shore 00)		ASTM 2240

70mils / 1.778 mm

1.61

80mils / 2.032 mm

1.77

Tensile Strength

40 psi

ASTM D412

90mils / 2.286 mm

1.91

100mils / 2.540 mm

2.05

Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

2.16

120mils / 3.048 mm

2.29

Dielectric Breakdown Voltage
>1500～>5500 VACASTM D149

130mils / 3.302mm

2.44

140mils / 3.556 mm

2.56

Dielectric Constant
5.5 MHzASTM D150

150mils / 3.810 mm

2.67

160mils / 4.064 mm

2.77

Volume Resistivity
4.0X10"
Ohm-meter		ASTM D257

170mils / 4.318 mm

2.89

180mils / 4.572 mm

2.98

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

3.05

200mils / 5.080 mm

3.14

Thermal conductivity
4.0W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470
Standard Thicknesses:

0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.
Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz

FACTORY INFORMATION:

Factory Size

5,000-10,000 square meters

Factory Country/Region

Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Annual Output Value

US$1 Million - US$2.5 Million

TIF100-40-10S Series Datasheet-(E)-REV01.pdf































Product tags

silicon free thermal gap pad

,

thermal conductive silicone pad

,

silicon thermal pad
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Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF160-40-10S
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz
Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz
Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz
Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz
Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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