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2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
Specifications
Brand Name :
Ziitek
Model Number :
TIE™ 280-25AB
Certification :
RoHs
Place of Origin :
China
MOQ :
2kg/LOT
Supply Ability :
1000KG
Delivery Time :
2-3 work day
Packaging Details :
1kg/can
Hardness @25℃ :
85 Shore D
Service temperature :
-40℃ to +130℃
Glass transition temperature Tg :
92℃
Elongation :
0.10%
Thermal Conductivity :
2.5 W/m-K
Dielectric Strength :
300 volts / mil
Description

2.5W / mK Low Viscosity Thermal Conductive Glue with -40℃ - 130℃ Service Temperature

TIE™ 280-25AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices.

TIE280-25 A&B.pdf

Features

> Good thermal conductive: 2.5W/mK

> Excellent insulation and smoothly sourface.

> Low shrinkage

> Low viscosity, expediting air releaseed.

> Excellent in solvents and water proof.

> Longer life time.

> Excellent thermal shock efficiecy and impact resistance

Application

> Automotive starters potting; General potting Thermal detector potting

> Ferrite adhesion; TIP type LED; Good adhesion to aromatic polyester

> Relay sealant; Good adhesion to rubber, ceramics PCB and plastics

> Power transformers and coils; Potting capacitors Potting of small electrical devices

> Adhesion to metal glass and plastic LCD & substrates adhesion; Coating and sealant; Coil ; IGBTS; Transformer; Fire retardant

> Optical / medical component adhesive


Typical Uncured Material TIE™ 280-25A (Resin)
Color Black
Viscosity@25℃ Brookfield 3,000 cPs
Specific Gravity 2.1 g/cc
Shelf life @25℃ in sealed container 12 months
TIE™ 280-25B (Hardener)
Color Black
Viscosity@25℃ Brookfield 5,000 cPs
Shelf life @25℃ in sealed container 12 months n

Mix Ratio (By weight) TIE™ 280-12A : TIE™ 280-12B = 100 : 100
Viscosity @25℃ 4,000 cPs
Working pot life (250 g @25℃) 45 min
Specific Gravity 2.1g/ccn
Cure Schedule
Cure 12 hours at 25℃
Cure 30 minutes at 70℃

Cured Properties
Hardness @25℃ 85 Shore D
Service temperature -40℃ to +130℃
Glass transition temperature Tg 92℃
Elongation 0.10%
Coefficient of thermal expansion, / ℃ 3.0 X 10-5
Fire resistance UL Meet 94 V-0
Moisture absorption % wt gain 24 hours water immersion @25℃ 0.1

Thermal
Thermal Conductivity 2.5 W/m-K
Thermal Impedance @10psi 0.31 ℃-in²/W
ELECTRICAL AS CURED
Dielectric Strength 300 volts / mil
Dielectric Constant 4.2 MHz
Dissipation factor 0.029 MHz
Volume resistivity, ohm-cm @ 25℃ 3.0 X 1012

2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D

Product tags

heatsink glue adhesive

,

heat transfer adhesive glue

,

thermal adhesive glue
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2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D

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Product Detail
Brand Name :
Ziitek
Model Number :
TIE™ 280-25AB
Certification :
RoHs
Place of Origin :
China
MOQ :
2kg/LOT
Supply Ability :
1000KG
Contact Supplier
2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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