Void Free Surface Thermal Conductive Adhesive 1.0W / mK for Power Modules / IGBT / Computer
TIS™580-10 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective. TIS™580-10 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use. TIS™580-10 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.
Feature
> Good thermal conductivity: 1.0W/mK
> Good maneuverability and good adhesion
> Low shrinkage
> Low viscosity, leads to void-free surface
> Good solvent resistance, water resistance
> Longer working life
> Excellent thermal shock resistance
Semiconductor cases and heat sinks |
Power resistors and chassis, thermostats and mating surfaces, and thermoelectric cooling devices |
CPUs and GPUs |
Automatic dispensing and screen-printing |
Mobile, desktop |
Engine and transmission control modules |
Memory modules |
Power conversion equipment |
Power supplies and UPS |
Power semiconductors |
Custom ASICS Chips |
Integrated Gate Bipolar Transistors (IGBT) |
Between any heat generating semiconductor and heat sink |
Custom power modules |
Telecommunications and automotive electronics |
LED Power Supply |
LED Controller |
LED Lights |
LED Ceilinglamp |
Typical values of TISTM580-10 | ||
Appearance | White paste | Test Method |
Density(g/cm3,25℃) | 1.3 | ASTM D297 |
Tack-free time(min,25℃) | ≤20 | ***** |
Cure type(1-component) | Dealcoholized | ***** |
Viscosity@25℃ Brookfield (Uncured) | 20K cps | ASTM D1084 |
Total cure time(d, 25℃) | 3-7 | ***** |
Elongation(%) | ≥150 | ASTM D412 |
Hardness(Shore A) | 25 | ASTM D2240 |
Lap Shear Strength(MPa) | ≥2.0 | ASTM D1876 |
Peel Strength(N/mm) | >3.5 | ASTM D1876 |
Operation temperature(℃) | -60~250 | ***** |
Volume Resistivity(Ω·cm) | 2.0×1016 | ASTM D257 |
Dielectric Strength(KV/mm) | 21 | ASTM D149 |
Dielectric Constant (1.2MHz) | 2.9 | ASTM D150 |
Thermal Conductivity W/(m·K) | 1.0 | ASTM D5470 |
Flame Retardancy | UL94 V-0 | E331100 |