-40℃ - 200℃ LED Lighting Thermal Conductive Glue with Two Component Fire Resistant Silica Encapsulant
TIS™ 680-28AB is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. It is design for potting of capacitors and electrical devices.Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features
> Good thermal conductive: 2.8W/mK
> Excellent insulation and smoothly sourface.
> Low shrinkage
> Low viscosity, expediting air releaseed.
> Excellent in solvents and water proof.
> Longer life time.
> Excellent thermal shock efficiecy and impact resistance
Application
> To potting LED Lighting heat spreader and power- driver.
> Ferrite cements; tip type LED; good cementation to aromatic polyester
> Relay sealant; Good adhesion to rubber, ceramics, PCB and plastics
> Power transformers and coils; Potting capacitors; Potting of small electrical devices
> Adhesion to metal glass and plastic; LCD & substrates adhesion; Coating and sealant; Coil ; IGBTS; Transformer; Fire retardant
> Optical / medical component adhesive
Typical Uncured Material TIS™ 680-28A (Resin) | |
Color | White |
Viscosity@25℃ Brookfield | 6,000 cPs |
Specific Gravity | 12.2g/cc |
Shelf life @25℃ in sealed container | 12 months |
TIS™ 680-28B (Hardener) | |
Color | White |
Viscosity@25℃ Brookfield | 6,000 cPs |
Shelf life @25℃ in sealed container | 12 months |
Mix Ratio (By weight) TIS™ 680-28A : TIS™ 680-28B = 100 : 100 | |
Viscosity @25℃ | 6000 cPs |
Working pot life (250 g @25℃) | 30 min |
Specific Gravity | 2.2 g/ccn |
Cure Schedule | |
Cure 3 hours at 25℃ | |
Cure 20 min at 70℃ |
Cured Properties | |
Hardness @25℃ | 85 Shore D |
Service temperature | -40℃ to +200℃ |
Glass transition temperature Tg | 92℃ |
Elongation | 4.50% |
Coefficient of thermal expansion, / ℃ | 3.0 x 10-5 |
Fire resistance UL | 94 V-0 |
Moisture absorption % wt gain 24 hours water immersion @25℃ | < 0.1 |
Thermal | |
Thermal Conductivity | 2.8 W/m-K |
Thermal Impedance @10psi | 0.28 ℃-in²/W |
ELECTRICAL AS CURED | |
Dielectric Strength | 400 volts / mil |
Dielectric Constant | 4.2 MHz |
Dissipation factor | 0.029 MHz |
Volume resistivity, ohm-cm @ 25℃ | 3.0 X 1013 |