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4w Heat Sink Pad 20 Shore00 3.1 G/Cc For Handheld Portable Electronics
4w Heat Sink Pad 20 Shore00 3.1 G/Cc For Handheld Portable Electronics
4w Heat Sink Pad 20 Shore00 3.1 G/Cc For Handheld Portable Electronics
4w Heat Sink Pad 20 Shore00 3.1 G/Cc For Handheld Portable Electronics
4w Heat Sink Pad 20 Shore00 3.1 G/Cc For Handheld Portable Electronics
4w Heat Sink Pad 20 Shore00 3.1 G/Cc For Handheld Portable Electronics
4w Heat Sink Pad 20 Shore00 3.1 G/Cc For Handheld Portable Electronics
4w Heat Sink Pad 20 Shore00 3.1 G/Cc For Handheld Portable Electronics
Specifications
Brand Name :
ZIITEK
Model Number :
TIF5100-40-11US
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
10000/day
Delivery Time :
3-5work days
Packaging Details :
1000pcs/bag
Hardness :
20 Shore 00
Specific Gravity :
3.1 g/cc
Dielectric Breakdown Voltage :
>5500 VAC
Fire rating :
94-V0
Construction & Compostion :
Ceramic filled silicone rubber
Tensile Strength :
40 psi
Description

China company supplied 4w heat sink pad 20 shore00 3.1 g/cc for Handheld portable electronics


The TIF5100-40-11US is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling TIF5100-40-11US maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. TIF5100-40-11US features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.Options and ConfigurationsStandard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made configurations available upon request

TIF500-40-11US Datasheet-REV02.pdf

Features:
> Good thermal conductive: 4.0 W/mK
>Thickness:2.5mmT
>hardnesses :20 (Shore 00)

>Naturally tacky needing no further adhesive coating

>Moldability for complex parts

>Outstanding thermal performance

>High durability


Applications:

>Handheld portable electronics

>Semiconductor automated test equipment (ATE)

>notebook

>power supply

>Heat pipe thermal solutions

>GPS navigation and other portable devices

>CD-Rom, DVD-Rom cooling

>LED Power Supply

Typical Properties of TIF5100-40-11US Series
Color

gray

 Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
 *** 10mils / 0.254 mm

0.55
20mils / 0.508 mm

0.82
Specific Gravity

3.1 g/cc

 ASTM D297

30mils / 0.762 mm

1.01

40mils / 1.016 mm

1.11
Thickness

2.5mmT

 ***

50mils / 1.270 mm

1.27

60mils / 1.524 mm

1.45
Hardness
 20 (Shore 00) ASTM 2240

70mils / 1.778 mm

1.61

80mils / 2.032 mm

1.77

Tensile Strength

40 psi

 ASTM D412

90mils / 2.286 mm

1.91

100mils / 2.540 mm

2.05
Continuos Use Temp
 -40 to 160℃

***

110mils / 2.794 mm

2.16

120mils / 3.048 mm

2.29

Dielectric Breakdown Voltage
 >5500 VAC ASTM D149

130mils / 3.302mm

2.44

140mils / 3.556 mm

2.56
Dielectric Constant
 4.0 MHz ASTM D150

150mils / 3.810 mm

2.67

160mils / 4.064 mm

2.77
Volume Resistivity
 6.0X1013
Ohm-meter		 ASTM D257

170mils / 4.318 mm

2.89

180mils / 4.572 mm

2.98
Fire rating
 94 V0

equivalent UL

190mils / 4.826 mm

3.05

200mils / 5.080 mm

3.14
Thermal conductivity
4.0 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

4w Heat Sink Pad 20 Shore00 3.1 G/Cc For Handheld Portable Electronics

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

FAQ:

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.

Product tags

laptop water cooling pad

,

portable electric heating pad

,

water cooling pad for laptop
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4w Heat Sink Pad 20 Shore00 3.1 G/Cc For Handheld Portable Electronics

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF5100-40-11US
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
video
4w Heat Sink Pad 20 Shore00 3.1 G/Cc For Handheld Portable Electronics
4w Heat Sink Pad 20 Shore00 3.1 G/Cc For Handheld Portable Electronics
4w Heat Sink Pad 20 Shore00 3.1 G/Cc For Handheld Portable Electronics
4w Heat Sink Pad 20 Shore00 3.1 G/Cc For Handheld Portable Electronics

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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