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Specific Gravity 1.9 G/Cc Thermal Gap Pad Silicone For Cpu
Specific Gravity 1.9 G/Cc Thermal Gap Pad Silicone For Cpu
Specific Gravity 1.9 G/Cc Thermal Gap Pad Silicone For Cpu
Specific Gravity 1.9 G/Cc Thermal Gap Pad Silicone For Cpu
Specifications
Brand Name :
ZIITEK
Model Number :
TIF140-01US
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
1000pcs/bag
Specific gravity :
1.9 g/cc
name :
Specific gravity 1.9 g/cc silicone pad High tack surface reduces contact resistance for CPU
Continuos Use Temp :
-40 to 160℃
Volume Resistivity :
2.9 MHz
keyword :
thermal gap pad
Thermal conductivity :
1.5 W/m-K
Description

Specific gravity 1.9 g/cc silicone pad High tack surface reduces contact resistance for CPU

The TIF140-01US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.

TIF100-01US-Series-Datasheet.pdf

Features

> Good thermal conductive: 1.5 W/mK

>Thickness:1.0mmT

>hardness:20 shore 00

>Colour: Black

>Easy release construction
>Electrically isolating
>High durability

Applications

>Automotive engine control units

>Telecommunication hardware

>Handheld portable electronics

>Semiconductor automated test equipment (ATE)

>CPU

>display card

Typical Properties of TIF140-01US Series
Color
black
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity
1.9 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
1.0mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
20 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgasing (TML)
0.35%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

2.9 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
1.5 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Specific Gravity 1.9 G/Cc Thermal Gap Pad Silicone For Cpu

FAQ:

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.

Product tags

silicon free thermal gap pad

,

silicon thermal pad

,

heatsink cooling thermal conductive silicone pad
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Specific Gravity 1.9 G/Cc Thermal Gap Pad Silicone For Cpu

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF140-01US
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
video
Specific Gravity 1.9 G/Cc Thermal Gap Pad Silicone For Cpu
Specific Gravity 1.9 G/Cc Thermal Gap Pad Silicone For Cpu

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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