1.5mmT popular and professional silicone pads for Memory Modules
The TIF160-01US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100-01US-Series-Datasheet.pdf
Features
> Good thermal conductive: 1.5 W/mK
>Thickness:1.5mmT
>hardness:20 shore 00
>Colour: Black
>Good thermal conductive
>Moldability for complex parts
>Soft and compressible for low stress applications
Applications
>mainboard/mother board
>notebook
>power supply
>Heat pipe thermal solutions
>Memory Modules
>Mass storage devices
Typical Properties of TIF160-01US Series | ||||
Color | black | Visual | Composite Thickness | Thermal Impedance@10psi (℃-in²/W) |
Construction & Compostion | Ceramic filled silicone elastomer | *** | 10mils / 0.254 mm | 0.16 |
20mils / 0.508 mm | 0.20 | |||
Specific gravity | 1.9 g/cc | ASTM D297 | 30mils / 0.762 mm | 0.31 |
40mils / 1.016 mm | 0.36 | |||
Thickness | 1.5mmT | *** | 50mils / 1.270 mm | 0.42 |
60mils / 1.524 mm | 0.48 | |||
Hardness | 20 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
80mils / 2.032 mm | 0.63 | |||
Outgasing (TML) | 0.35% | ASTM E595 | 90mils / 2.286 mm | 0.73 |
100mils / 2.540 mm | 0.81 | |||
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 0.86 |
120mils / 3.048 mm | 0.93 | |||
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.00 |
140mils /3.556 mm | 1.08 | |||
Dielectric Constant | 2.9 MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
160mils / 4.064 mm | 1.20 | |||
Volume Resistivity | 1.0X1012 Ohm-cm | ASTM D257 | 170mils / 4.318 mm | 1.24 |
180mils / 4.572 mm | 1.32 | |||
Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.41 |
200mils / 5.080 mm | 1.52 | |||
Thermal conductivity | 1.5 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
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