Good Thermal Conductivity Thermal Pad Ultra Soft 0.5mm Ultra Soft Thermal Gap Pad For LED Lighting
The TIF120-50-11ESeries thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features
> Good thermal conductive 5.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
Applications
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
Typical Properties of TIF120-50-11ESeries | ||
Property | Value | Test method |
Color | Gray | Visual |
Construction & Compostion | Ceramic filled silicone elastomer | ***** |
Thickness range | 0.020"(0.5mm)~0.200"(5.0mm) | ASTM D374 |
Specific Gravity | 3.15/cc | ASTM D792 |
Hardness | 35±5 Shore 00 | ASTM 2240 |
Continuos Use Temp | -40 to 160℃ | ****** |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
Dielectric Constant | 5.5 MHz | ASTM D150 |
Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 |
Fire rating | 94 V0 | equivalent UL |
Thermal conductivity | 5.0W/m-K | ASTM D5470 |
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL