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Ultra Soft Thermally Conductive Sheet Thermal Gap Pad Thermal Gap Filler For Low Stress Applications
Ultra Soft Thermally Conductive Sheet Thermal Gap Pad Thermal Gap Filler For Low Stress Applications
Ultra Soft Thermally Conductive Sheet Thermal Gap Pad Thermal Gap Filler For Low Stress Applications
Ultra Soft Thermally Conductive Sheet Thermal Gap Pad Thermal Gap Filler For Low Stress Applications
Specifications
Brand Name :
ZIITEK
Model Number :
TIF120-02F
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Payment Terms :
T/T
Supply Ability :
100000pcs/day
Delivery Time :
3-5 days
Packaging Details :
1000pcs/bag
Products name :
Ultra Soft Thermally Conductive Sheet Thermal Gap Pad Thermal Gap Filler For Low Stress Applications
Thermal conductivity :
1.5W/m-K
Thickness :
0.5mmT
Flame rating :
94-V0
Hardness :
60 shore 00
Specific gravity :
2.3g/cc
Outgassing :
0.35%
Keywords :
Thermal Gap Pad
Description

Ultra Soft Thermally Conductive Sheet Thermal Gap Pad Thermal Gap Filler For Low Stress Applications

With professional R&D capabilities and over 19 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

The TIF120-02F Series thermally conductive interface materials are applied to fillthe air gaps between the heating elements and the heat dissipation fins or themetal base.Their flexibility and elasticity make them suited to coat very unevensurfaces. Heat can transmit to the metal housing or dissipation plate from theheating elements or even the entire PCB, which effecitly enhances the efficiencyand life-time of the heat-generating electronic components.

Ultra Soft Thermally Conductive Sheet Thermal Gap Pad Thermal Gap Filler For Low Stress Applications
Features:


> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant


Applications

> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics

Typical Properties of TIF120-02F Series
Color Gray Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &Compostion Ceramic filled silicone elastomer *** 10mils / 0.254 mm 0.48
20mils / 0.508 mm 0.56
Specific Gravity 2.3 g/cc ASTM D297 30mils / 0.762 mm 0.71
40mils / 1.016 mm 0.8
Heat Capacity 1 l/g-K ASTM C351 50mils / 1.270 mm 0.91
60mils / 1.524 mm 0.94
Hardness 60 Shore 00 ASTM 2240 70mils / 1.778 mm 1.05
80mils / 2.032 mm 1.15
Tensile Strength 40 psi ASTM D412 90mils / 2.286 mm 1.25
100mils / 2.540 mm 1.34
Continuos Use Temp -40 to 160℃ *** 110mils / 2.794 mm 1.43
120mils / 3.048 mm 1.52
Dielectric Breakdown Voltage >5500 VAC ASTM D149 130mils / 3.302mm 1.63
140mils / 3.556 mm 1.71
Dielectric Constant 4.0 MHz ASTM D150 150mils / 3.810 mm 1.81
160mils / 4.064 mm 1.89
Volume Resistivity 4.0X10" Ohm-meter ASTM D257 170mils / 4.318 mm 1.98
180mils / 4.572 mm 2.07
Fire rating 94 V0 equivalent UL 190mils / 4.826 mm 2.14
200mils / 5.080 mm 2.22
Thermal conductivity 1.5 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470


Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Ultra Soft Thermally Conductive Sheet Thermal Gap Pad Thermal Gap Filler For Low Stress Applications

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Product tags

thermally conductive foam pad

,

xps rigid foam insulation

,

thermal conductive silicone pad
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Ultra Soft Thermally Conductive Sheet Thermal Gap Pad Thermal Gap Filler For Low Stress Applications

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF120-02F
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
video
Ultra Soft Thermally Conductive Sheet Thermal Gap Pad Thermal Gap Filler For Low Stress Applications
Ultra Soft Thermally Conductive Sheet Thermal Gap Pad Thermal Gap Filler For Low Stress Applications

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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