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High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU
High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU
High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU
High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU
Specifications
Brand Name :
ZIITEK
Model Number :
TIF180-02F
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Payment Terms :
T/T
Supply Ability :
100000pcs/day
Delivery Time :
3-5 days
Packaging Details :
1000pcs/bag
Products name :
High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU
Hardness :
60 shore 00
Thickness :
2.0mmT
Specific gravity :
2.3g/cc
Construction :
Ceramic filled silicone elastomer
Thermal condutivity :
1.5W/mK
Application :
Laptop Graphics Card CPU GPU
Keywords :
Thermal Conductive Silicone Pad
Description

High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

The TIF180-02F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipationfins or the metal base.Their flexibility and elasticity make them suited tocoat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU
Features:
> Good thermal conductivity: 1.5 W/mK

> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stressapplications
> Available in varies thickness

Application

> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics

Typical Properties of TIF180-02F Series
Color

Gray

 Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
 *** 10mils / 0.254 mm

0.48
20mils / 0.508 mm

0.56
Specific Gravity

2.3 g/cc

 ASTM D297

30mils / 0.762 mm

0.71

40mils / 1.016 mm

0.80
Heat Capacity

1 l/g-K

 ASTM C351

50mils / 1.270 mm

0.91

60mils / 1.524 mm

0.94
Hardness
 60 Shore 00 ASTM 2240

70mils / 1.778 mm

1.05

80mils / 2.032 mm

1.15

Tensile Strength

40 psi

 ASTM D412

90mils / 2.286 mm

1.25

100mils / 2.540 mm

1.34

Continuos Use Temp
 -40 to 160℃

***

110mils / 2.794 mm

1.43

120mils / 3.048 mm

1.52

Dielectric Breakdown Voltage
 >5500 VAC ASTM D149

130mils / 3.302mm

1.63

140mils / 3.556 mm

1.71
Dielectric Constant
 4.5 MHz ASTM D150

150mils / 3.810 mm

1.81

160mils / 4.064 mm

 1.89
Volume Resistivity
 1.0X10¹² Ohm-meter ASTM D257

170mils / 4.318 mm

1.98

180mils / 4.572 mm

2.07

Fire rating
 94 V0

equivalent UL

190mils / 4.826 mm

2.14

200mils / 5.080 mm

2.22

Thermal conductivity
 1.5 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470


Product Thicknesses:

0.020-inch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes:

8" x 16"(203mm x4O6mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

Product tags

heatsink cooling thermal conductive silicone pad

,

silicon thermal pad

,

thermal conductive silicone pad
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High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF180-02F
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
video
High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU
High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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