Specifications
Brand Name :
ZIITEK
Model Number :
TIF™540US Series
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
1000pcs/bag
Construction & Compostion :
Ceramic filled silicone rubber
Thermal conductivity :
2.6W/m-K
Hardness :
18 Shore 00
Specific Gravity :
2.95 g/cc
Continuos Use Temp :
-40to 160℃
Dielectric Breakdown Voltage :
>5500 VAC
colour :
Violet
Thickness :
1.0mmT
Description

CPU Silicone Rubber Thermal Gap Pad TIF540US 2.95 g/cc Cooling High Adhesive 2.6W/mK for Automotive engine control units

The TIF™540US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Features

> Good thermal conductive: 2.6W/mK
> Thickness:1.0mmT
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Fiberglass reinforced for puncture, shear and tear resistance
> Moldability for complex parts
> Electrically isolating

Applications

> Cooling components to the chassis of frame
>mainboard/mother board
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive electronics
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
Typical Properties of TIF™540US Series
Color

Violet

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm 0.36
20mils / 0.508 mm 0.41
Specific Gravity
2.95 g/cc ASTM D297

30mils / 0.762 mm

0.47

40mils / 1.016 mm

0.52
Thickness
1.0mmT ***

50mils / 1.270 mm

0.58

60mils / 1.524 mm

0.65

Hardness
18 Shore 00 ASTM 2240

70mils / 1.778 mm

0.72

80mils / 2.032 mm

0.79
Tensile Strength

45 psi

ASTM D412

90mils / 2.286 mm

0.87

100mils / 2.540 mm

0.94
Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

1.01

120mils / 3.048 mm

1.09
Dielectric Breakdown Voltage
>5500 VAC ASTM D149

130mils / 3.302mm

1.17

140mils / 3.556 mm

1.24
Dielectric Constant
4.3 MHz ASTM D150

150mils / 3.810 mm

1.34

160mils / 4.064 mm

1.42
Volume Resistivity
4.2X1013 Ohm-meter ASTM D257

170mils / 4.318 mm

1.50

180mils / 4.572 mm

1.60
Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

1.68

200mils / 5.080 mm

1.77
Thermal conductivity
2.6 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied

CPU Thermal Gap Filler Pad TIF540US 2.95 G/Cc Cooling High Adhesive 2.6W/MK For Automotive Engine Control Units

FACTORY INFORMATION:

Factory Size

5,000-10,000 square meters

Factory Country/Region

Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Send your message to this supplier
Send Now

CPU Thermal Gap Filler Pad TIF540US 2.95 G/Cc Cooling High Adhesive 2.6W/MK For Automotive Engine Control Units

Ask Latest Price
Watch Video
Brand Name :
ZIITEK
Model Number :
TIF™540US Series
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
video
CPU Thermal Gap Filler Pad TIF540US 2.95 G/Cc Cooling High Adhesive 2.6W/MK For Automotive Engine Control Units
CPU Thermal Gap Filler Pad TIF540US 2.95 G/Cc Cooling High Adhesive 2.6W/MK For Automotive Engine Control Units
CPU Thermal Gap Filler Pad TIF540US 2.95 G/Cc Cooling High Adhesive 2.6W/MK For Automotive Engine Control Units

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
Contact Supplier
Submit Requirement