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High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound Epoxy
High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound Epoxy
High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound Epoxy
High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound Epoxy
Specifications
Brand Name :
Ziitek
Model Number :
TIE380-25
Certification :
RoHs
Place of Origin :
China
MOQ :
2kg/LOT
Supply Ability :
1000KG
Delivery Time :
2-3 work day
Packaging Details :
1kg/can
Name :
High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound Epoxy
Appearance uncured :
Gray paste
Heat capacity :
0.7l/g-K
Key substrates :
Metals,ceranics
Components :
one conponent
Hardness @25℃ :
92 Shore A
Continuous use temp :
-40 to 180℃
Keywords :
Thermal Conductivity Epoxy Glue
Thermal conductivity :
2.5W/m-K
Description

High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound Epoxy


Product Summary:


TIETM380-25 is a one component, heat cured epoxy adhesive. lt has excellent thermal conductivity and bond strength.

TIETM380-25 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure.

TIE380-25.pdf

High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound Epoxy

Feature

> Good thermal conductive: 2.5W/mK
> Good maneuverability and adhesion performance

> Low shrinkage
> Low viscosity, easy-to-gas emissions

> Good solvent resistance, water resistance

> Longer working hours
> Excellent resistance to thermal shock

Applications

> Automotive starters potting; General potting;

> LED Controller
> LED Ceilinglamp
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power

Typical Properties of TIE380-25
Chemical type Epoxy Test Method
Appearance uncured Gray Paste Visual
Appearance cured Dull Gray Solid visual
Components One Component ******
Heat Capacity 0.7 l/g-K ASTM C351
Key Substrates Metals, ceramics ******
Hardness 92 Shore A ASTM 2240
Continuous Use Temp -40~180℃ ******
Tensile strength Al/Al@25°C >2800psi ******
Thermal Conductivity 2.5 W/m-K ASTM D5470
Application Features
Color Gray
Viscosity@25°℃ 150,000 cPs
Specific Gravity@25-℃ 2.1g/cc
Shelf life @25℃ 10 Days
Shelf life @0℃ 6 Months
Storage methods and temperature will affect the shelf life
Curing procedures
Curing temperature Curing time
100℃ 3 Hours
125℃ 1.5 Hour
150℃ 20 Minutes
170℃ 5 Minutes

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound Epoxy

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

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High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound Epoxy

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Product Detail
Brand Name :
Ziitek
Model Number :
TIE380-25
Certification :
RoHs
Place of Origin :
China
MOQ :
2kg/LOT
Supply Ability :
1000KG
Contact Supplier
High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound Epoxy
High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound Epoxy

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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